{"product_id":"b-r-x20if1082-2-x20-communication-interface-module","title":"B\u0026R X20IF1082-2 Module interface de communication X20","description":"\u003ch3\u003eSystem Functional Description\u003c\/h3\u003e\n\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eB\u0026amp;R X20IF1082-2 (X20IF1082-2)\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eis a specialized high-speed communication interface module designed for integration within the modular B\u0026amp;R X20 automation ecosystem. Deployed globally across demanding industrial environments including petrochemical refining plants, high-precision semiconductor lines, and automated material handling hubs, this module functions as an independent co-processor node. By offloading fieldbus communication management and protocol stacks from the primary CPU, it ensures ultra-low cycle times, minimizes processing jitter, and prevents data transmission bottlenecks during high-density data exchanges.\u003c\/p\u003e\n\u003ch3\u003eArchitectural Layout and Protocol Handling\u003c\/h3\u003e\n\u003cp\u003eThis interface module is engineered to provide flexible serial or dedicated fieldbus expansion directly within the local I\/O rack assembly. Utilizing an efficient internal processing layout, the hardware manages data encapsulation and packet serialization independently of the backplane bus logic. Equipped with localized transient voltage filters and complete galvanic isolation, the module safeguards internal PLC circuitry from high-voltage spikes and inductive ground loops common on factory floors, ensuring continuous network stability and message integrity over long-distance topologies.\u003c\/p\u003e\n\u003ch3\u003eTechnical Performance Matrix\u003c\/h3\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\"\u003e\n\u003ctd\u003e\u003cstrong\u003eCore Parameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cstrong\u003eOperational Specification\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModel\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eX20IF1082-2\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eBrand\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eB\u0026amp;R Automation\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOrigin\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eAustria\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModule Classification\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eCommunication Interface Module\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eSystem Architecture\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eIndependent Co-Processor Integration\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eGalvanic Isolation\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eIntegrated (Field interfaces isolated from backplane)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOperating Temperature\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0 to 55 deg C (Standard horizontal mounting)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eStorage Temperature\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e-25 to 85 deg C\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eRelative Humidity Window\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e5 to 95% (Non-condensing)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModule Dimensions (W x H x D)\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e25 x 99 x 74 mm\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eNet Structural Weight\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0.11 kg\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eShipping Gross Weight\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e1.5 kg (Enclosed in robust anti-static packaging)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eNetwork Diagnostics and FAQs\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eWhat are the primary troubleshooting steps if the module stops communicating with peripheral nodes?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eFirst, check the diagnostic status LEDs located on the front bezel of the X20IF1082-2. If the module status LED indicates an active error state or is turned off, verify the local backplane power levels. Next, open B\u0026amp;R Automation Studio and access the system logger to check for protocol configuration errors, hardware mismatches, or fieldbus timeout parameters.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eDoes this interface card require separate external power wiring to handle communication loads?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eNo. The X20IF1082-2 draws its baseline operating power directly from the internal logic and I\/O lines of the underlying X20 backplane. However, when building high-density I\/O configurations, always verify that the upstream X20 power supply module possesses sufficient remaining current capacity to cover this module's specific processing profile.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCan multiple X20IF1082-2 communication cards be installed into a single controller rack?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eYes. The X20 system architecture permits multiple interface modules to be mounted within the same local rack assembly, provided that the main CPU supports the total data throughput and that the maximum bus capacity is not exceeded. Each module handles its own communication processing independently, enabling multi-protocol fieldbus integration.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch3\u003eField Commissioning and Installation Directives\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eShield Grounding and Noise Isolation:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eWhen landing communication cables into the module interface, ensure that the cable shield makes direct contact with the designated low-impedance ground clips. Keep all data lines separate from high-voltage AC motor wires and variable frequency drive (VFD) output paths by at least 150 mm within cable trays to protect high-frequency signals from electromagnetic interference.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eModule Insertion and Alignment:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003ePrior to pushing the electronic component into its pre-installed bus base, visually inspect the backplane connector pins for dust or debris. Slide the module completely straight into the base until the mechanical locking latches fully engage. Ensure the base module is securely locked onto the DIN rail to prevent lateral displacement.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eEnclosure Ventilation Requirements:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eMount the module rack horizontally to optimize natural vertical air convection. Maintain a minimum perimeter clearance of 30 mm above and below the X20 module assembly. If ambient temperatures inside the control enclosure track near the maximum limit of 55 deg C, install an active cabinet filter fan to prevent thermal degradation.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e \u003c\/p\u003e","brand":"B\u0026R","offers":[{"title":"Default Title","offer_id":53086372102507,"sku":"X20IF1082-2","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/x20if1082-2-xpa5okfd4x5.png?v=1776138206","url":"https:\/\/www.plcprotech.com\/fr\/products\/b-r-x20if1082-2-x20-communication-interface-module","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}