{"product_id":"ge-mark-v-ds200tccag1baa-i-o-tc2000-analog-board","title":"Carte analogique E\/S TC2000 GE Mark V DS200TCCAG1BAA","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003e\u003cspan class=\"citation-29\"\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003c\/span\u003e\u003cstrong\u003eDS200TCCAG1BAA\u003c\/strong\u003e\u003cspan class=\"citation-29 citation-end-29\"\u003e\u003cspan\u003e \u003c\/span\u003eis a heavy-duty TC2000 Common Analog I\/O Module developed by General Electric for the Speedtronic Mark V Turbine Control System.\u003csup class=\"superscript\"\u003e\u003c\/sup\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003ePositioned within the R5 core of the control drive chassis, this processing board scales, conditions, and digitizes critical analog feedback from prime movers in power generation facilities, localized substations, and utilities. The board acts as a centralized interface for 4-20 mA current loops, resistance temperature detectors (RTDs), thermocouples, and turbine shaft monitoring parameters. By eliminating signal anomalies and routing real-time data to the system's central processing architecture, this unit directly drives down unplanned plant downtime, avoids thermal runaway in generator components, and secures operational continuous uptime under erratic field conditions.\u003c\/p\u003e\n\u003ch3\u003eTechnical Configuration\u003c\/h3\u003e\n\u003cp\u003e\u003cspan class=\"citation-28 citation-end-28\"\u003eThe DS200TCCAG1BAA architecture utilizes an onboard 16-bit Intel 80196 microprocessor running alongside hot-swappable Programmable Read-Only Memory (PROM) modules that contain active system firmware.\u003csup class=\"superscript\"\u003e\u003c\/sup\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003cspan class=\"citation-27 citation-end-27\"\u003eIt features two 50-pin ribbon cable interfaces, designated JCC and JDD, alongside a high-speed data bus link.\u003csup class=\"superscript\"\u003e\u003c\/sup\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eHardware configurations are governed via three manual PCB jumpers:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eJ1:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eEnables or disables the serial RS232 diagnostic communication port.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eJP2:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eDisables the internal oscillator circuit to initiate card-level testing and diagnostics.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eJP3:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eReserved exclusively for factory calibration routines.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSignal routing across the module relies on dedicated terminal interfaces:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eJAA \/ JBB:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eConnects to the CTBA terminal board for 4-20 mA output and input loops, utilizing precision burden resistors to monitor transducer current drops.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eJCC \/ JDD:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eRoutes RTD excitation current and resistance variations from the TBCA terminal board.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eJAR\/S\/T:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eCollects input streams from the TBQA thermocouple terminal board for cold-junction compensation calculations.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003e3PL:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eServes as the primary communication bridge, transmitting all conditioned analog metrics directly to the main STCA board and I\/O Engine.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\"\u003e\n\u003ctd\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModel\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eDS200TCCAG1BAA\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eBrand\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eGeneral Electric (GE)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOrigin\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eUnited States\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eSeries\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eMark V Speedtronic\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eBoard Type\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eTC2000 Common Analog I\/O Board\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eMicroprocessor\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e16-Bit Intel 80196\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eI\/O Channel Capacity\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eMulti-channel Thermocouple, RTD, and 4-20 mA Loops\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eCommunication Connector\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e3PL Data Bus Link\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eBoard Power Interface\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e2PL TCPS Distribution Link\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003ePCB Coating\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eNormal Coating\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eDimensions\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e28 cm x 18 cm\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0.45 kg\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOperating Temp\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0 to 60 deg C\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eStorage Temperature\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e-40 to 85 deg C\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eFAQs\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eHow do you preserve existing field calibrations when replacing a faulty DS200TCCAG1BAA board?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003c\/strong\u003eTo ensure the replacement board matches the original parameter set without manual reprogramming, physically extract the socketed PROM chips from the decommissioned board and insert them into the new assembly. This transfers all software tuning constants, thermocouple curves, and network configurations directly.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eWhat component isolates low-voltage processing chips from field-side electrical interference?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe board features onboard optocouplers and galvanic isolation networks alongside burden resistor arrays. These components insulate the 80196 microprocessor from high-voltage transients originating from field instrumentation and grounding differentials.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eWhy does the JEE connector remain unaccessed during normal turbine operation?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe JEE connector is engineered as a vestigial diagnostic structure. It provides factory technicians and advanced field service engineers with raw bus access for bench testing and firmware flashing, and must remain unpopulated during standard automated operations.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eHow does the TCCA board process multi-type RTD signals without hardware jumpers?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan class=\"citation-26 citation-end-26\"\u003eThe board relies on fixed internal excitation currents to measure changing resistance values.\u003csup class=\"superscript\"\u003e\u003c\/sup\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003cspan class=\"citation-25 citation-end-25\"\u003eDifferentiation between specific platinum, copper, or nickel RTD curves is handled digitally via software parameters configured in the HMI I\/O Configuration Editor.\u003csup class=\"superscript\"\u003e\u003c\/sup\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003chr\u003e\n\u003ch3\u003eEngineering \u0026amp; Installation Guide\u003c\/h3\u003e\n\u003ch4\u003eStep-by-Step PROM Module Migration\u003c\/h4\u003e\n\u003col class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003eTurn off all power to the Mark V turbine control cabinet and isolate the card cage.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGround yourself using an ESD wrist strap connected to the metal chassis framework.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eInsert a flat-bladed screwdriver gently under one end of the PROM module on the decommissioned board and lift. Repeat on the opposite end until the chip pops out of its socket. Place it immediately in an anti-static bag.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAlign the pins of the original PROM with the socket on the replacement DS200TCCAG1BAA board, ensuring correct orientation based on the chip notch.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003ePress straight down on the center of the module until it seats firmly. Avoid touching exposed metal pins to prevent static corruption.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003ch4\u003eField Signal Grounding and Noise Avoidance\u003c\/h4\u003e\n\u003cp\u003eAll 4-20 mA current loop and thermocouple wiring from the CTBA, TBQA, and TBCA terminal boards must utilize twisted, shielded pairs. Terminate cable shields globally at the cabinet terminal grounding bar using 360-degree grounding clamps. Do not braid or pig-tail the shield drain wires at the card level, as this creates a high-inductance path that compromises data transmission inside high-frequency electromagnetic interference (EMI) drive environments.\u003c\/p\u003e\n\u003ch4\u003eThermal Management and Airflow Constraints\u003c\/h4\u003e\n\u003cp\u003eWhen mounting the board into the R5 Core slot, inspect adjacent modules for dust accumulation or heat discoloration. Maintain unhindered vertical convection airflow through the card cage. If cabinet temperatures consistently exceed 50 deg C, verify the functionality of forced-air cooling fans at the base of the cabinet to prevent thermal drifting of the analog scaling circuits.\u003c\/p\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":52695407100267,"sku":"DS200TBCAG1AAB","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/general-electric-ds200tbcag1aab-rtd-termination-module-gjbkjhkmgi4_f98377b0-5945-44e6-ad79-09f4d2109f9d.jpg?v=1766134930","url":"https:\/\/www.plcprotech.com\/fr\/products\/ge-mark-v-ds200tccag1baa-i-o-tc2000-analog-board","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}