{"product_id":"ge-mark-v-ds200tccag1baa-tc2000-common-analog-i-o-board","title":"Carte E\/S analogique commune TC2000 GE Mark V DS200TCCAG1BAA","description":"\u003ch3\u003eTechnical Overview \u0026amp; Industrial Deployment\u003c\/h3\u003e\n\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eDS200TCCAG1BAA (DS200TCCAG1BAA)\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eis a core-level analog signal processing instrument developed by General Electric for the legacy Mark V Speedtronic gas and steam turbine control framework. Operating from the central R5 control core, this multi-layer interface board acts as the primary data aggregation node for high-precision telemetry, scaling and conditioning raw field inputs before transferring them to the system logic solvers. Power utilities, petrochemical refineries, and heavy mechanical drive plants deploy the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eDS200TCCAG1BAA (DS200TCCAG1BAA)\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eto oversee delicate thermal profiles, multi-channel current loops, and rotational mechanical stability indicators. By unifying multi-source field signals into a single standardized bus structure, the board guarantees predictable governor behavior, shields heavy rotating turbines from sudden hunting or thermal fatigue, and minimizes unplanned operational downtime in heavy industrial setups.\u003c\/p\u003e\n\u003ch3\u003eArchitectural Circuitry \u0026amp; Signal Mapping\u003c\/h3\u003e\n\u003cp\u003eThe structural engineering of the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eDS200TCCAG1BAA\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eboard integrates discrete microprocessing logic with multi-functional acquisition sub-circuits.\u003c\/p\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eIntegrated Microcontroller Logic:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eFeatures an onboard Intel 80196 processor that executes independent signal conditioning algorithms, scaling raw field data locally using instructions saved within socketed, erasable Programmable Read-Only Memory (PROM) blocks.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eThermal Monitoring Infrastructure:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eIncorporates dedicated RTD excitation circuitry and cold-junction compensation calculations. It monitors RTD resistance shifts across the JCC and JDD connectors while translating thermocouple signals via the TBQA terminal board interface.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eDynamic Current Loop Management:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eUtilizes onboard burden resistors across the JBB connector path to drop incoming 4-20 mA transducer currents into readable voltage steps, while simultaneously sourcing regulated 4-20 mA current outputs through the JAA connector to drive remote instruments.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eTurbine Shaft Telemetry:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eHosts specialized shaft monitoring subsystems that continuously track electrical potential and current leakage across the turbine shaft, delivering vital insulation degradation telemetry to the central I\/O engine through the 3PL bus.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHardware Parameters \u0026amp; Operational Indexes\u003c\/h3\u003e\n\u003ctable style=\"width: 100%; height: 391.876px;\"\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\" style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cstrong\u003eSystem Parameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cstrong\u003eFactory Engineering Index\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eModel Designation\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eDS200TCCAG1BAA (Parent Board: DS200TCCAG1)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eBrand Identifier\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eGeneral Electric (GE Boards \u0026amp; Turbine Control)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eControl System Series\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eSpeedtronic Mark V (TC2000 Subseries)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eFunctional Acronym\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eTCCA Card\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eCore Mounting Location\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eR5 Control Chassis Slot\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eOnboard Logic CPU\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e16-Bit Intel 80196 Microprocessor\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eFirmware Storage Architecture\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eSocketed, Removable PROM Modules\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 39.1875px;\"\u003e\u003cspan\u003e\u003cstrong\u003ePrimary Master Communication Link\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 39.1875px;\"\u003e\u003cspan\u003e3PL Data Bus Connector (To STCA \/ I\/O Engine)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 39.1875px;\"\u003e\u003cspan\u003e\u003cstrong\u003eField Analog Input Sourcing\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 39.1875px;\"\u003e\u003cspan\u003e4-20 mA Loops, Thermocouples, RTDs, Shaft Monitors\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003ePhysical Dimensions\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e28.0 x 18.0 cm\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eNet Hardware Weight\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e0.45 kg\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003ePrinted Circuit Protection\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eNormal Industrial Grade Coating\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eHardware Revision Hierarchy\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eFunctional Revisions B and A, Artwork Revision A\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eOperational Thermal Limits\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e0 to 60 deg C\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.1875px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 39.1875px;\"\u003e\u003cspan\u003e\u003cstrong\u003eLogic Power Input Feed\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 39.1875px;\"\u003e\u003cspan\u003e2PL Power Distribution Plug (Sourced via TCPS Board)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.5938px;\"\u003e\n\u003ctd style=\"width: 41.0714%; height: 19.5938px;\"\u003e\u003cspan\u003e\u003cstrong\u003eCountry of Origin\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd style=\"width: 56.0714%; height: 19.5938px;\"\u003e\u003cspan\u003eUnited States\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eTechnical Diagnostics FAQs\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eWhat are the primary functions of the onboard hardware jumpers J1, JP2, and JP3?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eJumper J1 controls the operational status of the local serial RS232 programming port. Jumper JP2 disables the integrated onboard clock oscillator, which is necessary during card-level benchmark and bench testing routines. Jumper JP3 is a dedicated factory testing link and must remain in its default factory location during standard turbine operations.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eHow is the operator workspace interface physically linked to the processing circuits of this board?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe operator interface (designated as ) links to the DS200TCCAG1BAA board using the intermediate CTBA terminal card. The CTBA card anchors the 4-20 mA signal runs, connecting to the TCCA board via the JAA output and JBB input headers to allow seamless display data flow to the HMI screen.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eHow does the TCCA board reconcile different thermal response curves for varying thermocouple or RTD configurations?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe board relies on software-driven I\/O configuration constants rather than fixed component adjustments. Field engineers enter specific sensor coefficients and curve types into the I\/O Configuration Editor on the HMI terminal. The internal 80196 microcontroller reads these constant registers to adjust its processing algorithms for each channel.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch3\u003eField Engineering \u0026amp; Maintenance Protocol\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eFirmware PROM Transfer and Electrostatic Safeguards:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eTo maintain correct software compatibility when deploying a replacement card, you must move the original PROM modules from the faulty board to the replacement unit. Use a flat-bladed screwdriver to lift each chip end evenly from its socket, and place it inside a static-shielding pouch. Personnel must wear a properly grounded ESD wrist strap throughout this procedure to prevent latent static breakdown of the semiconductor logic.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eAnalog Shield Grounding and Signal Separation:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eAll analog connections routing into connectors JAA, JBB, JCC, and JDD must utilize high-density twisted-pair shielded conductors. Ground the copper shields exclusively at the designated terminal board ground bar. Floating or dual-ended grounding introduces ground potential loops, creating electrical ripples that can corrupt delicate thermocouple and RTD temperature assessments.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003ePower Down Rules and Vestigial Connector Restrictions:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eIsolate the 2PL power distribution plug before sliding the TCCA card into or out of the R5 core frame. Handling the module while the backplane is live causes voltage spikes across the 3PL data bus, risking memory corruption. Additionally, the JEE connector is a vestigial structural layout; do not attach external wiring or debugging tools to this terminal during normal operations.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":52695408312683,"sku":"DS200TCCAG1BAA","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/general-electric-ds200tccag1baa-tc2000-common-analog-i-o-board-1rgj3eq3xld_18ef5e77-4d52-4e78-8624-d948bb0ce270.jpg?v=1766134965","url":"https:\/\/www.plcprotech.com\/fr\/products\/ge-mark-v-ds200tccag1baa-tc2000-common-analog-i-o-board","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}