{"product_id":"ge-mark-vies-is200tbais1c-analog-input-terminal-board","title":"Carte de bornes d'entrée analogique GE Mark VIeS IS200TBAIS1C","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eIS200TBAIS1C (IS200TBAIS1C)\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eis a mission-critical, high-integrity Analog Input Terminal Board custom-engineered by General Electric for the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eMark VIeS\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003efunctional safety and functional turbine protection framework. Functioning as the localized structural termination layer for safety-instrumented loops, this passive hardware card channels raw low-voltage analog sensor signals from the field directly into active processing networks. High-risk, continuous-process industries—including chemical separation matrices, combined-cycle power utilities, and LNG compression stations—rely on the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eIS200TBAIS1C (IS200TBAIS1C)\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eto sustain real-time monitoring circuits. By featuring complete conformal PCB protection layers and certified compliance for hazardous location boundaries, this board isolates sensitive controller cores from high-voltage field faults, suppresses high-frequency induction noise, and prevents false safety trips that lead to facility downtime.\u003c\/p\u003e\n\u003ch3\u003eTechnical Configuration \u0026amp; Infrastructure Features\u003c\/h3\u003e\n\u003cp\u003eThe internal architecture, circuit layout, and signal processing parameters of the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eIS200TBAIS1C\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003etermination card guarantee steady automation tracking.\u003c\/p\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eHigh-Density Analog Ingestion:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eOutfitted with dedicated terminal barrier strips engineered to accept multiple independent channels of millivolt, volt, or 4-20 mA current loop transmitter feeds concurrently.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eHazLoc Environmental Certification:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eFully validated under official GEH-6725 guidelines for safe mounting within certified Class I, Division 2 explosive boundaries and Zone 2 hazardous gas groups without arcing risks.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eConformal Insulation Protection:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eCoated with a uniform, factory-applied thin-film insulation chemical layer that seals copper paths against moisture tracking, marine salt spray, and airborne hydrogen sulfide corrosion.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003ePassive-to-Active Modular Marriage:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eServes as the structural mounting foundation for active IS220 series analog I\/O packs, utilizing integrated multi-pin connection headers to route conditioned logic telemetry.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePerformance Specifications \u0026amp; Engineering Index\u003c\/h3\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\"\u003e\n\u003ctd\u003e\u003cstrong\u003eSystem Parameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cstrong\u003eFactory Document Specification Standard\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModel Designation\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eIS200TBAIS1C\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eBrand Manufacturer\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eGE Gas Power (General Electric Automation)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eControl System Line\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eSpeedtronic Mark VIeS Safety Control Platform\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModule Classification\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eHigh-Density Analog Input Termination Board\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eChannel Signal Type\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e4-20 mA current loops, Voltage inputs, Transducer loops\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eCabinet Configuration\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eDesigned for Compact and Redundant Enclosures\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eHazardous Location Rating\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eClass I, Div 2, Groups A, B, C, D \/ Zone 2 IIC T4\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003ePCB Protective Barrier\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eComprehensive Conformal Coated Substrate\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003ePhysical Card Size\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eStandard GE Terminal Board Profile (approx. 16 cm x 11 cm)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOperating Ambient Window\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e-30 to +65 deg C Continuous Thermal Exposure\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eStorage Temperature Boundaries\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e-40 to +85 deg C Maximum Extended Limits\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eManufacturing Location\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eUnited States (USA)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eSubstation Engineering \u0026amp; Lifecycle FAQs\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eWhat specific field applications demand the deployment of the C-revision IS200TBAIS1C board over earlier updates?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003ccode\u003eIS200TBAIS1C\u003c\/code\u003e\u003cspan\u003e \u003c\/span\u003erevision integrates enhanced component suppression networks and specific conformal coating standards validated under modern GEH-6725R safety guidelines. It is engineered specifically for functional safety loops in Mark VIeS configurations where continuous analog data—such as critical fuel valve positions or high-pressure steam telemetry—must remain uncorrupted during localized electrical surges.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eDoes this passive terminal board limit the thermal operating parameters of the attached active I\/O packs?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eAccording to official HazLoc temperature matrices, the passive board substrate handles a wide ambient thermal envelope from -30 to +65 deg C. However, field engineers must cross-verify the specific documentation for the attached active electronic packs (such as the\u003cspan\u003e \u003c\/span\u003e\u003cem\u003eIS220UCSAH1A\u003c\/em\u003e\u003cspan\u003e \u003c\/span\u003eor specific\u003cspan\u003e \u003c\/span\u003e\u003cem\u003eIS220PAIC\u003c\/em\u003e\u003cspan\u003e \u003c\/span\u003eblocks) as certain active processing components operate under tighter windows (e.g., 0 to 65 deg C) due to localized internal microchip power dissipation.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCan field wiring be landed onto the terminal blocks while the host control system remains energized?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eTo shield internal analog-to-digital converters and sensitive sensor loops from inductive transient damage or unexpected short-circuits during field installation, you must isolate signal loop power before terminating or disconnecting instrumentation lines from the screw blocks.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch3\u003eField Engineering \u0026amp; Installation Protocol\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eTerminal Screw Torque and Terminal Landings:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eWhen landing external shielded analog wires onto the barrier terminal blocks of the IS200TBAIS1C, strip back wire insulation by exactly 6 mm. Terminate the conductors into the screw clamps and apply a maximum tightening torque profile of 0.5 N-m (4.4 inch-lbs). Overtorquing can fracture the underlying solder pads, while loose connections will introduce signal resistance anomalies, degrading 4-20 mA reading accuracy under low-frequency turbine deck vibration.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eShield Grounding and Drain Wire Termination:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eTo maintain full compliance with the electromagnetic compatibility guidelines detailed in the Mark VIeS manual, all field instrumentation shield drain wires must be gathered and bonded cleanly to the designated cabinet earth grounding bar. Do not allow raw shield braids to contact adjacent signal traces on the board face, preventing ground loop offsets from corrupting localized differential analog logic.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eConformal Coating Care and Enclosure Clearance:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eWhile the board features a G3 conformal coating shell to resist moisture and airborne corrosive gases within industrial areas, take absolute care during panel sliding actions to avoid scoring the substrate surface. Maintain a minimal free-air convection clearance gap of 4 cm around the board boundaries inside the enclosure housing to encourage passive heat dissipation, preventing local hotspots from reducing the lifespan of internal passive components.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e \u003c\/p\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":52695407395179,"sku":"IS200TBAIS1C","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/general-electric-is200tbais1c-analog-i-o-terminal-board-zsfxjsr0wxl_3dc3c7b1-4276-4d2e-8ef5-ee6f134b55ec.jpg?v=1766134938","url":"https:\/\/www.plcprotech.com\/fr\/products\/ge-mark-vies-is200tbais1c-analog-input-terminal-board","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}