{"product_id":"mitsubishi-electric-q13udvcpu-melsec-q-series-universal-high-speed-cpu-module","title":"Mitsubishi Electric Q13UDVCPU MELSEC-Q Series Universal High-Speed CPU Module","description":"\u003ch3\u003eDescription\u003c\/h3\u003e\n\u003cp\u003eDesigned for demanding industrial automation architectures, the \u003cstrong\u003eQ13UDVCPU\u003c\/strong\u003e serves as a high-performance, universal-type Central Processing Unit within the Mitsubishi Electric MELSEC-Q Series platform. This controller is engineered to process complex sequence programs with extreme speed, featuring a base instruction speed of 1.9 ns for basic logic operations. The integrated architecture supports multi-CPU setups, enabling rapid data exchange across shared memory regions and seamless synchronization with motion controller modules.\u003c\/p\u003e\n\n\u003cp\u003eThe \u003cstrong\u003eQ13UDVCPU CPU Module\u003c\/strong\u003e incorporates an onboard Ethernet port supporting up to 100 Mbps communication speeds, alongside an SD\/SDHC memory card slot for flexible project storage and data logging up to 32 GB. With a substantial program capacity of 130K steps and robust protection features, this module is optimized for large-scale production environments requiring rapid scan cycles and tight integration with network-level factory systems.\u003c\/p\u003e\n\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eHigh-speed processing execution reaching 1.9 ns for LD instructions and 3.9 ns for MOV instructions.\u003c\/li\u003e\n  \u003cli\u003eGenerous storage capabilities with 130K steps program memory (520 KB) and support for external SD\/SDHC memory cards up to 32 GB.\u003c\/li\u003e\n  \u003cli\u003eOnboard 10\/100 Mbps Ethernet communication port for MELSOFT connections, socket communication, and MC protocol.\u003c\/li\u003e\n  \u003cli\u003eExtended standard RAM capacity of 1024 KB, further expandable via optional SRAM cassettes up to 8 MB.\u003c\/li\u003e\n  \u003cli\u003eSupport for multi-CPU systems with a dedicated high-speed communication area of 32 KB.\u003c\/li\u003e\n  \u003cli\u003eFlexible programming support accommodating Relay symbol, MELSAP 3 (SFC), MELSAP-L, Function Blocks, and Structured Text (ST).\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eApplications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eHigh-speed assembly and packaging machinery.\u003c\/li\u003e\n  \u003cli\u003eMulti-axis motion control and coordination systems.\u003c\/li\u003e\n  \u003cli\u003eAutomotive assembly lines and paint shop operations.\u003c\/li\u003e\n  \u003cli\u003eWater treatment facilities and distributed infrastructure control.\u003c\/li\u003e\n  \u003cli\u003eComplex raw material handling and processing systems.\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n  \u003ctbody\u003e\n    \u003ctr\u003e\n      \u003cstrong\u003eCategory\u003c\/strong\u003e\n      \u003cstrong\u003eSpecification Parameter\u003c\/strong\u003e\n      \u003cstrong\u003eValue\u003c\/strong\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"4\"\u003e\u003cstrong\u003eIdentity\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eManufacturer\u003c\/td\u003e\n      \u003ctd\u003eMitsubishi Electric\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eModel \/ Part Number\u003c\/td\u003e\n      \u003ctd\u003eQ13UDVCPU\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eSeries\u003c\/td\u003e\n      \u003ctd\u003eMELSEC-Q Series (Universal Model)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eControl Method\u003c\/td\u003e\n      \u003ctd\u003eStored program iteration operation\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"3\"\u003e\u003cstrong\u003ePerformance Specs\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eSequence Instruction Speed (LD X0)\u003c\/td\u003e\n      \u003ctd\u003e1.9 ns\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eSequence Instruction Speed (MOV D0 D1)\u003c\/td\u003e\n      \u003ctd\u003e3.9 ns\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eProgram Capacity\u003c\/td\u003e\n      \u003ctd\u003e130K steps (520 KB)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"5\"\u003e\u003cstrong\u003eMemory Capacity\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eProgram Memory (Drive 0)\u003c\/td\u003e\n      \u003ctd\u003e520 KB\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eStandard RAM (Drive 3)\u003c\/td\u003e\n      \u003ctd\u003e1024 KB (Expandable up to 8 MB with SRAM cassette)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eStandard ROM (Drive 4)\u003c\/td\u003e\n      \u003ctd\u003e2051 KB\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eCPU Shared Memory (Standard)\u003c\/td\u003e\n      \u003ctd\u003e8 KB\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eCPU Shared Memory (High-Speed Multi-CPU)\u003c\/td\u003e\n      \u003ctd\u003e32 KB\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"2\"\u003e\u003cstrong\u003eI\/O Capabilities\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eNumber of I\/O Device Points\u003c\/td\u003e\n      \u003ctd\u003e8192 points (X\/Y 0 to 1FFF)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eNumber of Physical I\/O Points\u003c\/td\u003e\n      \u003ctd\u003e4096 points (X\/Y 0 to FFF)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"3\"\u003e\u003cstrong\u003eEthernet Interface\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eData Transmission Speed\u003c\/td\u003e\n      \u003ctd\u003e100 \/ 10 Mbps\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eCommunication Mode\u003c\/td\u003e\n      \u003ctd\u003eFull duplex \/ Half duplex\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eMaximum Connections\u003c\/td\u003e\n      \u003ctd\u003e16 (Socket, MELSOFT, MC Protocol) + 1 (FTP)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"2\"\u003e\u003cstrong\u003eElectrical Requirements\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eInternal Current Consumption (DC 5 V)\u003c\/td\u003e\n      \u003ctd\u003e0.58 A (Base unit) \/ 0.60 A (With SRAM cassette)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eAllowable Momentary Power Failure Time\u003c\/td\u003e\n      \u003ctd\u003eDependent on the power supply module used\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"3\"\u003e\u003cstrong\u003ePhysical Attributes\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eDimensions (H x W x D)\u003c\/td\u003e\n      \u003ctd\u003e98 mm x 27.4 mm x 115 mm\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eModule Weight\u003c\/td\u003e\n      \u003ctd\u003e0.20 kg\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eShipping Weight\u003c\/td\u003e\n      \u003ctd\u003e2.0 kg\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"3\"\u003e\u003cstrong\u003eEnvironmental Limits\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eOperating Temperature\u003c\/td\u003e\n      \u003ctd\u003e0 to 55 degC\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eStorage Temperature\u003c\/td\u003e\n      \u003ctd\u003e-25 to 75 degC\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eAmbient Operating Humidity\u003c\/td\u003e\n      \u003ctd\u003e5 to 95% RH (Non-condensing)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd rowspan=\"2\"\u003e\u003cstrong\u003eMechanical Resilience\u003c\/strong\u003e\u003c\/td\u003e\n      \u003ctd\u003eVibration Resistance\u003c\/td\u003e\n      \u003ctd\u003eConforms to JIS B 3502 and IEC 61131-2\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eImpact Resistance\u003c\/td\u003e\n      \u003ctd\u003eConforms to JIS B 3502 and IEC 61131-2 (147 m\/s2)\u003c\/td\u003e\n    \u003c\/tr\u003e\n  \u003c\/tbody\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eInstallation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eMounting:\u003c\/strong\u003e Install the module directly onto a compatible MELSEC-Q Series base unit. Secure the lock mechanism firmly to prevent mechanical disconnection during operations.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eEnclosure Protection:\u003c\/strong\u003e Ensure the CPU and base rack are mounted inside a dust-free, non-corrosive control panel classified for pollution degree 2 or less.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eThermal Management:\u003c\/strong\u003e Maintain a minimum clearance of 30 mm above and below the module to allow adequate convection cooling, ensuring ambient temperature inside the enclosure remains below 55 degC.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eGrounding:\u003c\/strong\u003e Ensure the base unit’s protective earth terminal is connected to an independent class-D ground point using heavy-gauge wire to prevent electoral noise interference.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Mitsubishi Electric","offers":[{"title":"Default Title","offer_id":53102131347819,"sku":"Q13UDVCPU","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/Q13UDVCPU-y5qdc1oirc3.png?v=1776137927","url":"https:\/\/www.plcprotech.com\/id\/products\/mitsubishi-electric-q13udvcpu-melsec-q-series-universal-high-speed-cpu-module","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}