{"product_id":"ge-mark-iv-speedtronic-ds3800hmpk1f1b-microprocessor-regulator-card","title":"GE Mark IV Speedtronic DS3800HMPK1F1B Microprocessor Regulator Card","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eDS3800HMPK1F1B (DS3800HMPK1F1B)\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eis a legacy, high-reliability microprocessed logic computing architecture designed by General Electric for the pioneering\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eSpeedtronic Mark IV\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003egas and steam turbine control suite. Operating as a primary controller card, this regulator substrate runs high-speed loop algorithms, processes variable field instrument metrics, and coordinates real-time feedback loop tuning to protect continuous industrial drives. Heavy continuous-process operations—such as base-load utility power generation stations, high-capacity petrochemical refineries, and marine industrial propulsion hubs—rely on the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eDS3800HMPK1F1B (DS3800HMPK1F1B)\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eto prevent transient governor hunting or overspeed faults. By placing localized computing power right on the board rack, this module shortens command execution windows. This lets the system respond quickly to grid loading changes, protects high-value mechanical rotors, and keeps industrial operations online by reducing unprogrammed system shutdowns.\u003c\/p\u003e\n\u003ch3\u003eComponent Topography \u0026amp; Signal Routing\u003c\/h3\u003e\n\u003cp\u003eThe physical board layout, communication ports, and localized diagnostic clusters of the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eDS3800HMPK1F1B\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eregulator card are engineered for fast maintenance access and low signal attenuation.\u003c\/p\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eDirect Bus Connecting Matrix:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eOutfitted with a premium rear-facing modular connector block that plugs straight into the backplane, routing input voltage rails and logic communication signals without external cabling.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eOnboard Execution Architecture:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eIntegrates a heavy-duty processing core supported by factory-embedded Erasable Programmable Read-Only Memory (EPROM) chips that hold core speed-control software constants securely.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eDual Ribbon Connection Ports:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eHouses two 50-pin ribbon headers and an auxiliary 34-pin connector designed to transfer high-density diagnostic data and external control signals across adjacent rack cards.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eChassis Level Ejection Handles:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eBuilt with durable mechanical extraction levers on the outer edge to lock the substrate into the slot rails and provide a safe grip for fast component replacement.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eHigh-Visibility Diagnostic Lights:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eFeatures a cluster of four diagnostic status LEDs (3 red indicators and 1 amber light) aligned with the front card edge to report runtime validation and fault warnings directly.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePerformance Specifications \u0026amp; Physical Dimensions\u003c\/h3\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\"\u003e\n\u003ctd\u003e\u003cstrong\u003eControl Parameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cstrong\u003eTechnical Specification Standard Values\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModel Identity\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eDS3800HMPK1F1B\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eBrand Manufacturer\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eGeneral Electric (GE Boards \u0026amp; Turbine Control)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eControl System Line\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eSpeedtronic Mark IV Turbine Control Platform\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eModule Classification\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eMicroprocessor Regulator Card \/ Governor Logic Substrate\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eProcessor Technology\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eOnboard Microprocessor with socketed EPROM chips\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eInterface Port Layout\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e1 x Modular Rack Connector \/ 2 x 50-Pin Ports \/ 1 x 34-Pin Port\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eVisual Monitoring Cluster\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e4 x Front-Facing LEDs (Three Red, One Amber)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eNominal Operating Supply\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e24 VDC Supplied directly through the backplane contacts\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003ePhysical Dimensions\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e160 mm x 160 mm Standard Form Factor Frame\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eNet Equipment Weight\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eApproximately 0.5 kg\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOperating Thermal Window\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0 to 60 deg C Baseplate Ambient Temperature Parameters\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eStorage Temperature Bounds\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e-40 to +85 deg C Structural Storage Limits\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eManufacturing Location\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eUnited States (USA)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eTurbine Regulation \u0026amp; System FAQs\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eWhat specific operational telemetry do the four front-mounted LEDs provide during runtime?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe four front-facing LEDs act as an emergency diagnostic array. Under normal processing operations, their flashing states indicate active data throughput and microprocessor logic verification. If an internal memory checksum error occurs, or if a critical communication line breaks down, the lights drop out of sequence or trigger a specific error pattern to help field technicians troubleshoot the problem quickly.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eHow does the rear modular connector design simplify installation inside the Mark IV panel rack?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe rear-facing modular connector combines power distribution and logic signal routing into a single interface. As the board slides along the rack guide rails, the male and female connector halves align and seat together perfectly. This eliminates the need to route separate power and signal cables, reducing wiring clutter and keeping signal attenuation low.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eDoes this version of the DS3800HMPK1F1B include internal software programming options?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eNo. This board uses socketed Erasable Programmable Read-Only Memory (EPROM) chips that hold pre-compiled factory firmware code. Site-specific turbine constants and speed loop profiles must be burned onto these memory chips prior to final insertion into the card slot to ensure proper runtime integration with the parent control system.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch3\u003eEngineering \u0026amp; Installation Guide\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eElectrostatic Grounding and EPROM Component Handling:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe microprocessors and erasable programmable ROM chips on the DS3800HMPK1F1B are highly sensitive to electrostatic discharge (ESD). Field engineers must wear a properly bonded anti-static wrist strap connected to the enclosure framework before removing the board from its static-resistant shipping bag. Handle the card strictly by its fiberglass borders and outer mechanical levers to avoid touching the trace lines or pins.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eCard Extraction and Ribbon Cable Management:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eBefore pulling a card from the rack, disconnect the 34-pin ribbon cable located between the extraction handles, followed by the dual 50-pin ribbon connectors. Lift up on the twin mechanical retention levers together to unlatch the rear modular contacts smoothly. Use the handles to pull the card straight out along the guide rails, preventing pin bend or scratch damage to adjacent slots.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eConvection Cooling Clearances and Contaminant Management:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eThe board relies on natural upward convection through the 160 mm x 160 mm layout to maintain stable component temperatures. Keep the areas directly above and below the card slots clear of wiring bundles or obstruction plates. Periodically blow out accumulated non-conductive dust to prevent thermal buildup, keeping the surrounding air within the certified 0 to 60 deg C operating window.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":52695407034731,"sku":"DS3800HMPK1F","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/general-electric-ds3800hmpk1f1b-avanced-control-module-1kg1cfpcgtw_6c4637db-97ab-4ee1-ae30-0d2b53bc0ce0.jpg?v=1766134927","url":"https:\/\/www.plcprotech.com\/products\/ge-mark-iv-speedtronic-ds3800hmpk1f1b-microprocessor-regulator-card","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}