{"product_id":"general-electric-is200aepah1bmf-high-performance-i-o-pack-processor-board","title":"General Electric IS200AEPAH1BMF High-Performance I\/O Pack Processor Board","description":"\u003ch3\u003eDescription\u003c\/h3\u003e\n\u003cp\u003eThe General Electric IS200AEPAH1BMF is a high-performance I\/O pack processor board designed for advanced industrial turbine control systems. Developed as part of the Mark VIe and EX2100 product lines, this printed circuit board assembly manages critical input and output signal processing to ensure precise, reliable operation in heavy-duty gas and steam turbine environments. Built to meet stringent industrial standards, the module integrates seamlessly into distributed control systems (DCS) requiring robust communication and high-speed data handling.\u003c\/p\u003e\n\u003cp\u003eAs a core processing component within the Mark VIe architecture, the IS200AEPAH1BMF executes control algorithms and coordinates terminal boards and processor networks via embedded Ethernet routing capabilities. Its hardware configuration is optimized for continuous industrial uptime, minimizing latency in signal acquisition and execution across complex automation networks.\u003c\/p\u003e\n\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eDesigned specifically for General Electric Mark VIe and EX2100 turbine control platforms\u003c\/li\u003e\n  \u003cli\u003eHigh-performance processor architecture for rapid I\/O data handling and execution\u003c\/li\u003e\n  \u003cli\u003eIntegrated Ethernet communication interface for seamless DCS network connectivity\u003c\/li\u003e\n  \u003cli\u003ePrinted circuit board assembly engineered for high reliability in demanding industrial environments\u003c\/li\u003e\n  \u003cli\u003eDirectly replaces legacy auxiliary and processor boards within compatible control cabinets\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eApplications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eGas turbine management and control systems\u003c\/li\u003e\n  \u003cli\u003eSteam turbine automation and regulation\u003c\/li\u003e\n  \u003cli\u003eHeavy industrial distributed control systems (DCS)\u003c\/li\u003e\n  \u003cli\u003eEX2100 excitation and Mark VIe rack configurations\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003ctable\u003e\n  \u003cthead\u003e\n    \u003ctr\u003e\n      \u003cth\u003eParameter\u003c\/th\u003e\n      \u003cth\u003eSpecification\u003c\/th\u003e\n    \u003c\/tr\u003e\n  \u003c\/thead\u003e\n  \u003ctbody\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eManufacturer\u003c\/td\u003e\n      \u003ctd\u003eGeneral Electric\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eCatalog Number \/ Model\u003c\/td\u003e\n      \u003ctd\u003eIS200AEPAH1BMF\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eProduct Series\u003c\/td\u003e\n      \u003ctd\u003eMark VIe \/ EX2100\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eModule Type\u003c\/td\u003e\n      \u003ctd\u003eI\/O Pack Processor Board\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eSystem Compatibility\u003c\/td\u003e\n      \u003ctd\u003eDistributed Control System (DCS)\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eCommunication Interface\u003c\/td\u003e\n      \u003ctd\u003eEthernet Router\u003c\/td\u003e\n    \u003c\/tr\u003e\n    \u003ctr\u003e\n      \u003ctd\u003eCountry of Origin\u003c\/td\u003e\n      \u003ctd\u003eUnited States\u003c\/td\u003e\n    \u003c\/tr\u003e\n  \u003c\/tbody\u003e\n\u003c\/table\u003e\n\n\u003ch3\u003eConnections \/ Interfaces\u003c\/h3\u003e\n\u003cp\u003eThe IS200AEPAH1BMF features onboard Ethernet communication ports designed to interface directly with local control networks and companion terminal boards. Standardized plug-in connections ensure secure integration into Mark VIe racks, facilitating power distribution and high-speed data exchange with minimal wiring complexity.\u003c\/p\u003e\n\n\u003ch3\u003eInstallation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003eEnsure all rack power is completely disconnected before installing or removing the processor board.\u003c\/li\u003e\n  \u003cli\u003eObserve proper electrostatic discharge (ESD) precautions, including the use of a grounded wrist strap, when handling the printed circuit board.\u003c\/li\u003e\n  \u003cli\u003eVerify that the backplane connectors and slot alignment match the IS200AEPAH1BMF specifications prior to insertion.\u003c\/li\u003e\n  \u003cli\u003eSecure any locking mechanisms or retaining screws firmly to prevent vibration-related loosening in industrial environments.\u003c\/li\u003e\n  \u003cli\u003eConfirm network address settings and firmware compatibility with the existing Mark VIe system configuration before powering on the rack.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":52695409459563,"sku":"IS200AEPAH1BMF","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/general-electric-is200aepah1bmf-high-performance-i-o-pack-processor-boards-hc2ow2jmapz_2a06a4b5-25a5-425f-b131-ae83e2fafafc.jpg?v=1766135006","url":"https:\/\/www.plcprotech.com\/products\/general-electric-is200aepah1bmf-high-performance-i-o-pack-processor-board","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}