{"product_id":"general-electric-is200hslah1ade-mark-vie-hs-serial-link-interface-board","title":"General Electric IS200HSLAH1ADE Mark VIe HS Serial Link Interface Board","description":"\u003ch3\u003eDescription\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eIS200HSLAH1ADE\u003c\/strong\u003e is a high-speed (HS) serial link interface board designed for integration within host application board setups. This communication module provides high-speed data communications across alternative energy management systems, working in combination with a variety of other compatible modules and terminal boards. Domestically manufactured as a Group One product within the series, the \u003cstrong\u003eIS200HSLAH1ADE\u003c\/strong\u003e features a specialized design that omits any non-standard assembly versions or SCOM grounding output terminals. The printed circuit board is protected by a conformal style coating layer to safeguard the electronic circuitry from operational degradation.\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eProvides high-speed serial link interface capabilities for reliable data communication pathways.\u003c\/li\u003e\n\u003cli\u003eIntegrates seamlessly with diverse host application boards and control modules within the system framework.\u003c\/li\u003e\n\u003cli\u003eDesigned as a Group One product variation manufactured without an SCOM grounding output terminal.\u003c\/li\u003e\n\u003cli\u003eEquipped with a defensive conformal PCB coating style to enhance environmental durability.\u003c\/li\u003e\n\u003cli\u003eMaintains full backwards-compatibility with the original base-level functional design revision.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eApplications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAlternative Energy Infrastructure\u003c\/strong\u003e: Deployed in wind, solar, and specialized steam turbine alternative energy generation systems.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIndustrial High-Speed Communication\u003c\/strong\u003e: Providing high-speed data link bridging across core control applications and peripheral network blocks.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eValue\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eManufacturer\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eGE Energy\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePart Number\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eIS200HSLAH1ADE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eSeries\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eMark VIe\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eFunctional Acronym\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eHSLA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eFunctional Description\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eHS Serial Link Interface\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePCB Coating Type\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eConformal Coating\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eFunctional Revision 1\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eFunctional Revision 2\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eArtwork Revision\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eCountry of Origin\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e0.45 KG\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eDimensions (W x H x D)\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e18 mm x 300 mm x 150 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eInstallation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eEnsure the power source supplying the host application chassis is completely isolated and powered down before board insertion or removal.\u003c\/li\u003e\n\u003cli\u003eUse static-safe handling protocols during installation to prevent damage to the onboard logic and communication paths.\u003c\/li\u003e\n\u003cli\u003eConfirm that the board aligns properly with the chassis card guides before firmly seating it into its designated backplane mating position.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":52695416308075,"sku":"IS200HSLAH1ADE","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/general-electric-is200hslah1ade-hs-slr-lnk-interface-board-njoybwfp2ye_72c1a6f0-2c98-46c4-aa2f-cd465729ace7.jpg?v=1766135259","url":"https:\/\/www.plcprotech.com\/products\/general-electric-is200hslah1ade-mark-vie-hs-serial-link-interface-board","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}