{"product_id":"general-electric-is210bppch1a-mark-vie-i-o-pack-processor-board","title":"General Electric IS210BPPCH1A Mark VIe I\/O Pack Processor Board","description":"\u003ch3\u003eDescription\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eIS210BPPCH1A\u003c\/strong\u003e is an I\/O pack processor board designed for high-performance data processing and communication within the \u003cstrong\u003eMark VIe\u003c\/strong\u003e control system platform. This double-sided circuit board utilizes surface mount technology (SMT) to securely house components on both its top and bottom layers. Engineered as a functional upgrade to legacy BPPB-based packs, the \u003cstrong\u003eIS210BPPCH1A\u003c\/strong\u003e integrates dual-channel network communications and advanced processing logic to support real-time industrial automation applications. While it is classified as a non-safety pack and is not suitable for deployment in Mark VIeS safety systems, it is fully capable of running in Triple Modular Redundant (\u003cstrong\u003eTMR\u003c\/strong\u003e) control environments alongside legacy hardware configurations.\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eBuilt using advanced double-sided Surface Mount Technology (SMT) to optimize component density and reliability.\u003c\/li\u003e\n\u003cli\u003eConfigured for seamless integration with systems running ControlST software V04.04 or later.\u003c\/li\u003e\n\u003cli\u003eEquipped with dual top-side Ethernet ports to support redundant network communication paths.\u003c\/li\u003e\n\u003cli\u003eCompatible with legacy BPPB-based I\/O packs when integrated into Triple Modular Redundant (TMR) architectures.\u003c\/li\u003e\n\u003cli\u003eFeatures specialized corner and edge cutouts designed to ensure precise physical alignment within the enclosure.\u003c\/li\u003e\n\u003cli\u003eIncorporates ringed, conductive factory-drilled mounting holes for robust mechanical stability and electrical grounding.\u003c\/li\u003e\n\u003cli\u003eIntegrated with a comprehensive array of onboard components, including a top-side protective fuse, chokes, jumper switches, and dedicated test points.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eApplications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eGeneral Electric Mark VIe turbine control networks\u003c\/li\u003e\n\u003cli\u003eTriple Modular Redundant (TMR) control architectures \u003c\/li\u003e\n\u003cli\u003eHigh-availability industrial process automation systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eManufacturer\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eGeneral Electric\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eSeries\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eMark VIe\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003ePart Number\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eIS210BPPCH1A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eBoard Classification\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eBPPC I\/O Pack Processor Card\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eAssembly Style\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eDouble-sided board with Surface Mount Technology (SMT)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eControlST Compatibility\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eVersion V04.04 or later \u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eRedundancy Configurations\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eSimplex and TMR (Triple Modular Redundant) \u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cstrong\u003eSafety System Compatibility\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003eNon-safety (Not for use in Mark VIeS systems)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eConnections\/Interfaces\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eInterface Component\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eBoard Location\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eFunctional Description\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eEthernet Ports (Dual)\u003c\/td\u003e\n\u003ctd\u003eTop Side\u003c\/td\u003e\n\u003ctd\u003ePrimary network communication interfaces\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Connectors\u003c\/td\u003e\n\u003ctd\u003eTop and Bottom Sides\u003c\/td\u003e\n\u003ctd\u003eInter-board power and data routing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eJumper Switches\u003c\/td\u003e\n\u003ctd\u003eBottom Side\u003c\/td\u003e\n\u003ctd\u003eHardware and address configuration settings\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTest Points\u003c\/td\u003e\n\u003ctd\u003eBottom Side\u003c\/td\u003e\n\u003ctd\u003eDiagnostic and signal testing interfaces\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSafety Fuse\u003c\/td\u003e\n\u003ctd\u003eTop Side\u003c\/td\u003e\n\u003ctd\u003eOnboard overcurrent component protection\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eInstallation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003ePre-Installation Review:\u003c\/strong\u003e Carefully read through all official documentation and manuals before unboxing and handling the board.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSoftware Prerequisites:\u003c\/strong\u003e Confirm that the system is updated to ControlST V04.04 or later and that the BPPC I\/O Upgrade V05.01.03 is fully installed across the system architecture prior to commissioning the board.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eESD and Safety Protocols:\u003c\/strong\u003e Ensure proper electrostatic discharge (ESD) safety procedures are followed during installation. Confirm all power sources connected to the drive enclosure are completely isolated.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMechanical Mounting:\u003c\/strong\u003e Align the board using the corner and edge cutouts, securing it with the factory-drilled conductive mounting holes to establish a clean ground path.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":52695421550955,"sku":"IS210BPPCH1ACA","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/general-electric-is210bppch1a-i-o-pack-processor-daughterboard-tg03bw2fd4m_b1522ac5-73cf-4496-8788-f897651c3dc4.jpg?v=1766135432","url":"https:\/\/www.plcprotech.com\/products\/general-electric-is210bppch1a-mark-vie-i-o-pack-processor-board","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}