{"product_id":"honeywell-mc-pail02-51304481-150-high-performance-process-manager-low-level-analog-input-module","title":"Honeywell MC-PAIL02 51304481-150 High-Performance Process Manager Low Level Analog Input Module","description":"\u003ch3\u003eDescription\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eHoneywell MC-PAIL02\u003c\/strong\u003e (\u003cstrong\u003e51304481-150\u003c\/strong\u003e) is a conformally coated Low Level Analog Input (\u003cstrong\u003eLLAI\u003c\/strong\u003e) Input\/Output Processor (\u003cstrong\u003eIOP\u003c\/strong\u003e) card designed for the High-Performance Process Manager (\u003cstrong\u003eHPM\u003c\/strong\u003e) subsystem in TotalPlant Solution (\u003cstrong\u003eTPS\u003c\/strong\u003e) and TDC 3000 control systems. It provides signal processing to interface field instrumentation with the subsystem controller. The \u003cstrong\u003eMC-PAIL02\u003c\/strong\u003e card accepts low-level analog signals, including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt sources, as well as high-level inputs such as 0-5 V voltage sources and 4-20 mA current loop devices. Featuring conformal coating for protection in harsh and corrosive industrial environments, the module communicates with High-Performance Process Manager Modules (\u003cstrong\u003eHPMM\u003c\/strong\u003e) across the I\/O Link Interface. Signal channels are isolated from each other and from the \u003cstrong\u003eHPM\u003c\/strong\u003e logic, utilizing a dedicated common bus for field wire shield terminations.\u003c\/p\u003e\n\u003ch3\u003eFeatures\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eSupports low-level analog inputs including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt (mV) sources.\u003c\/li\u003e\n\u003cli\u003eAccepts high-level analog inputs including 0-5 V voltage sources and 4-20 mA current loops.\u003c\/li\u003e\n\u003cli\u003eChannel-to-channel and channel-to-HPM logic isolation for signal integrity and noise immunity.\u003c\/li\u003e\n\u003cli\u003eConformally coated printed circuit board assembly (MC prefix) suitable for harsh environmental conditions.\u003c\/li\u003e\n\u003cli\u003eInstalls into 7-Slot or 15-Slot High-Performance Process Manager IOP card files.\u003c\/li\u003e\n\u003cli\u003eCommunicates with High-Performance Process Manager Modules (HPMM) via the high-speed I\/O Link Interface.\u003c\/li\u003e\n\u003cli\u003eCommon bus structure for process field wire shield grounding.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eApplications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eTemperature measurement using Thermocouples and RTDs in process plant environments.\u003c\/li\u003e\n\u003cli\u003eMillivolt and current loop signal monitoring in DCS systems.\u003c\/li\u003e\n\u003cli\u003eAnalog input processing in Honeywell High-Performance Process Manager (HPM) automation architectures.\u003c\/li\u003e\n\u003cli\u003eI\/O integration in harsh or corrosive process locations requiring conformally coated modules.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eOrdering Information\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003ePart Number\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eModel Number\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eDescription\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eCoating Type\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e51304481-150\u003c\/td\u003e\n\u003ctd\u003eMC-PAIL02\u003c\/td\u003e\n\u003ctd\u003eLow Level Analog Input (LLAI) IOP Module\u003c\/td\u003e\n\u003ctd\u003eConformal\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e51304481-100\u003c\/td\u003e\n\u003ctd\u003eMU-PAIL02\u003c\/td\u003e\n\u003ctd\u003eLow Level Analog Input (LLAI) IOP Module\u003c\/td\u003e\n\u003ctd\u003eNon-Conformal\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eManufacturer\u003c\/td\u003e\n\u003ctd\u003eHoneywell\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel Number\u003c\/td\u003e\n\u003ctd\u003eMC-PAIL02\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePart Number\u003c\/td\u003e\n\u003ctd\u003e51304481-150\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eModule Type\u003c\/td\u003e\n\u003ctd\u003eLow Level Analog Input (LLAI) Input\/Output Processor (IOP)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eArchitecture Compatibility\u003c\/td\u003e\n\u003ctd\u003eHigh-Performance Process Manager (HPM) \/ TPS \/ TDC 3000\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLow Level Signal Inputs\u003c\/td\u003e\n\u003ctd\u003eThermocouples (TC), Resistance Temperature Detectors (RTD), Millivolt (mV) sources\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eHigh Level Signal Inputs\u003c\/td\u003e\n\u003ctd\u003e0-5 VDC voltage sources, 4-20 mA current loops\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSignal Channel Isolation\u003c\/td\u003e\n\u003ctd\u003eIsolated from each other and HPM logic; common bus for field shields\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAssembly Protection\u003c\/td\u003e\n\u003ctd\u003eConformal Coating (MC Series)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCard File Compatibility\u003c\/td\u003e\n\u003ctd\u003e7-Slot and 15-Slot HPM \/ IOP Card Files\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBus Interface\u003c\/td\u003e\n\u003ctd\u003eI\/O Link Interface\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eInstallation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSlot Placement:\u003c\/strong\u003e Insert the \u003cstrong\u003eMC-PAIL02\u003c\/strong\u003e module into an available slot within a 7-Slot or 15-Slot IOP card file.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eShield Grounding:\u003c\/strong\u003e Connect field wire shields to the common shield bus to minimize electromagnetic noise and interference.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eESD Handling:\u003c\/strong\u003e Use standard ESD precautions and protective grounding when handling and installing the circuit board assembly.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInterfacing:\u003c\/strong\u003e Connect to field termination points using compatible Field Termination Assemblies (FTAs) and Honeywell interface cables.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCompliance and Certifications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eCE Compliant (when installed in CE-compliant card files and cabinet enclosures)\u003c\/li\u003e\n\u003cli\u003eApproved for use in Division 2 hazardous locations (when integrated into approved HPM cabinet configurations)\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Honeywell","offers":[{"title":"Default Title","offer_id":52679225606507,"sku":"MC-PAIL02","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0953\/3227\/0443\/files\/51304481-150-j5nelhxpa3s_f2fb1270-2c41-402f-983d-2da8baeed5b3.jpg?v=1765958104","url":"https:\/\/www.plcprotech.com\/products\/honeywell-mc-pail02-51304481-150-high-performance-process-manager-low-level-analog-input-module","provider":"PLC ProTech Ltd.","version":"1.0","type":"link"}