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Honeywell 900C30-0360-00 HC900 C30 Controller CPU

Honeywell 900C30-0360-00 HC900 C30 Controller CPU

Only 5 item(s) left in stock
  • Manufacturer: Honeywell

  • Product No.: 900C30-0360-00

  • Country of origin:United States

  • Product Type: PLC CPU Modules

  • Payment: T/T, Western Union

  • Weight: 3000g

  • Shipping port: Xiamen

  • Warranty: 12 months

Quantity
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Description

Executing complex regulatory and logic control sequences across process industries, the Honeywell 900C30-0360-00 serves as the centralized computing core for the HC900 Control System platform. This modular controller integrates analog and digital control loops seamlessly, hosting a robust processing architecture designed to handle high-density industrial I/O. Its optimized form factor fits directly into dedicated HC900 rack assemblies, facilitating high-speed backplane communications and direct synchronization with specialized power supplies and expanding I/O modules.

Features

  • High-Capacity Function Library: Supports up to 400 functional configuration blocks to execute advanced PID, logic, and math calculations.
  • Scalable I/O Matrix: Efficiently coordinates up to 384 digital and 192 high-level analog channels per processing station.
  • Robust Modular Architecture: Direct integration with 4-slot, 8-slot, or 12-slot heavy-duty metal rack enclosures.
  • Industrial Compliance: Engineered for Installation Category II and Pollution Degree 2 environments under IEC 664 and UL840 design standards.

Applications

  • Process control loops in industrial furnaces, kilns, and multi-zone ovens.
  • Boiler and steam generation management systems.
  • Water and wastewater treatment plant automation.
  • Chemical batch processing and custody transfer systems.

Technical Specifications Table

Parameter Specification Value
Manufacturer Honeywell
Model Number 900C30-0360-00
Control Series HC900 C30
Function Blocks 400 max
Max Universal Analog Inputs 96 channels
Max High-Level Analog Inputs 192 channels
Max Analog Outputs 40 channels (internal) / 192 channels (external power)
Max Digital I/O Points 384 channels
Rack Capacity Supports 4, 8, or 12 slot configurations
Installation Standard Category II, Pollution Degree 2 (IEC 664, UL840)
Operating Temperature 0 to 60 degC
Shipping Weight (Calculated) 3.00 kg

Connections and Interfaces

Port / Terminal Connection Interface Protocol & Assignment
Ethernet Port (RJ45) Modbus/TCP, Peer-to-Peer engineering tool access
Serial Port (RS485) Modbus RTU master/slave connectivity
Backplane Connector High-speed bus interface for chassis power and module address routing

Empirical Engineering Insights

Alternative Models & Compatibility

The 900C30-0360-00 model replaces legacy variations in the HC900 hardware line. When swapping processors, verify that your Hybrid Control Designer (HCD) software version matches the processor firmware revision (typically firmware v4.x or higher) to prevent configuration load mismatch faults. Hardware form-factor remains identical, allowing immediate slot-in replacement.

Application Pitfalls & Engineering Notes

A common design oversight involves power distribution calculations. Although the C30 CPU handles significant analog I/O density, exceeding backplane power capacities on 8-slot and 12-slot configurations requires an external power booster or auxiliary 24V DC loops. Always partition loop-powered analog transmitters to external distribution blocks to maintain CPU thermal margins.

Commissioning & Wiring Tips

To eliminate communication packet drops over the network port, ensure that the RJ45 industrial Ethernet cabling is shielded (S/FTP) and that the shield drains to the main cabinet chassis earth point. Avoid running serial RS485 communication runs parallel to variable frequency drive (VFD) motor leads to bypass heavy electromagnetic coupling.

Installation Guidelines

CRITICAL WARNING: De-energize all power sources feeding the target backplane rack assembly before inserting or extracting the CPU. Attempting live-swapping of the CPU processor module can cause permanent data corruption in non-volatile flash memory, trigger a watch-dog trip, or damage backplane logic gates.
1

Align the guide rails of the 900C30 CPU module with the dedicated controller slot (typically Slot 1) in the modular rack chassis.

2

Firmly slide the controller module rearward until the 96-pin connector engages seamlessly with the chassis backplane receptacle.

3

Secure the module's mechanical fasteners to ensure vibration isolation and optimal thermal grounding.

Can the 900C30-0360-00 CPU module be hot-swapped while the rack is powered?

No. The 900C30-0360-00 does not support Hot-Swapping. You must completely de-energize the rack before removing or installing the CPU module to prevent physical damage to the module backplane connections or data loss.

What software is required to configure this processor?

This module is configured using Honeywell Hybrid Control Designer (HCD) software. Ensure your software version matches or exceeds the module firmware level to prevent initialization conflicts.

Does this C30 CPU module support redundant system configurations?

No, the C30 controller is intended for non-redundant applications. For full CPU redundancy, you must utilize the HC900 C70 or C75 control processors and corresponding chassis assemblies.

Global Express Shipping

  • Standard Delivery: 4-6 Business Days via DHL, FedEx, and UPS.
  • Express Dispatch: Same-day dispatch for in-stock orders placed before 2:00 PM (GMT+8).
  • Worldwide Coverage: Serving over 150 countries, including rapid delivery to Saudi Arabia and UAE.

Returns & Warranty

  • 30-Day Guarantee: Returns accepted for in-stock products in original, factory-sealed packaging.
  • 12-Month Warranty: Every industrial component is backed by our professional technical warranty.

Orders are processed and delivered Monday-Friday (excluding public holidays).


For full eligibility, restocking fees, and international return details, please view our official Refund & Return Policy .

TECHNICAL SPECIFICATIONS

Country of origin
United States

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