Description

The IS200VRTDH1DAC operates as a high-density RTD input board developed by General Electric for deployment within the Mark VI Speedtronic turbine control platform. This assembly functions as a specialized temperature monitoring component that interfaces directly with external thermal resistance elements, supporting up to sixteen 3-wire RTD inputs through remote terminal boards. The IS200VRTDH1DAC routes field temperature measurements into the central VME rack architecture, facilitating integrated software linearization for precise closed-loop thermal regulation across gas and steam turbine configurations.

Features

• Multi-Channel RTD Scalability: Built to handle sixteen independent 3-wire RTD inputs via remote terminal board interfacing.
• Integrated Software Linearization: Provides automated correction profiles tailored for 10 Ohm copper, 100/200 Ohm platinum, or 120 Ohm nickel RTD sensing configurations.
• Flexible Grounding Topology: Supports both grounded and ungrounded field sensor installation structures to suit localized system baselines.
• Onboard Signal Isolation and Density: Populated with over 200 capacitors, several hundred resistors, and more than 200 integrated circuits including high-capacity Field Programmable Gate Arrays (FPGAs).
• Conformal Surface Layering: Treated with a thin, protective conformal coating to preserve connection lines against continuous industrial environmental variables.

Applications

• Mark VI Speedtronic gas and steam turbine thermal monitoring
• High-density bearing and stator winding temperature measurement loops
• VME rack configuration data acquisition systems

Technical Specifications

Installation Guidelines

• VME Rack Fastening: Guide the card into its designated VME rack mounting assembly slot until the rear connectors mate with the backplane, then lock the metallic single-slot faceplate via the three structural fixing screws.
• Signal Line Routing: Do not connect RTD field wires directly to this module. Route all external sensor loops to the companion RTD terminal board, and bridge the signals using the specified high-density cable assemblies.
• Thermal Mitigation: Verify that the drilled cooling pathways surrounding targeted processing chips remain clear of obstructions during rack cabinet panel layout execution.