Manufacturer: Honeywell
Product No.: 900C30-0360-00
Country of origin:United States
Product Type: PLC CPU Modules
Payment: T/T, Western Union
Weight: 3000g
Shipping port: Xiamen
Warranty: 12 months
Executing complex regulatory and logic control sequences across process industries, the Honeywell 900C30-0360-00 serves as the centralized computing core for the HC900 Control System platform. This modular controller integrates analog and digital control loops seamlessly, hosting a robust processing architecture designed to handle high-density industrial I/O. Its optimized form factor fits directly into dedicated HC900 rack assemblies, facilitating high-speed backplane communications and direct synchronization with specialized power supplies and expanding I/O modules.
| Parameter | Specification Value |
|---|---|
| Manufacturer | Honeywell |
| Model Number | 900C30-0360-00 |
| Control Series | HC900 C30 |
| Function Blocks | 400 max |
| Max Universal Analog Inputs | 96 channels |
| Max High-Level Analog Inputs | 192 channels |
| Max Analog Outputs | 40 channels (internal) / 192 channels (external power) |
| Max Digital I/O Points | 384 channels |
| Rack Capacity | Supports 4, 8, or 12 slot configurations |
| Installation Standard | Category II, Pollution Degree 2 (IEC 664, UL840) |
| Operating Temperature | 0 to 60 degC |
| Shipping Weight (Calculated) | 3.00 kg |
| Port / Terminal Connection | Interface Protocol & Assignment |
|---|---|
| Ethernet Port (RJ45) | Modbus/TCP, Peer-to-Peer engineering tool access |
| Serial Port (RS485) | Modbus RTU master/slave connectivity |
| Backplane Connector | High-speed bus interface for chassis power and module address routing |
The 900C30-0360-00 model replaces legacy variations in the HC900 hardware line. When swapping processors, verify that your Hybrid Control Designer (HCD) software version matches the processor firmware revision (typically firmware v4.x or higher) to prevent configuration load mismatch faults. Hardware form-factor remains identical, allowing immediate slot-in replacement.
A common design oversight involves power distribution calculations. Although the C30 CPU handles significant analog I/O density, exceeding backplane power capacities on 8-slot and 12-slot configurations requires an external power booster or auxiliary 24V DC loops. Always partition loop-powered analog transmitters to external distribution blocks to maintain CPU thermal margins.
To eliminate communication packet drops over the network port, ensure that the RJ45 industrial Ethernet cabling is shielded (S/FTP) and that the shield drains to the main cabinet chassis earth point. Avoid running serial RS485 communication runs parallel to variable frequency drive (VFD) motor leads to bypass heavy electromagnetic coupling.
Align the guide rails of the 900C30 CPU module with the dedicated controller slot (typically Slot 1) in the modular rack chassis.
Firmly slide the controller module rearward until the 96-pin connector engages seamlessly with the chassis backplane receptacle.
Secure the module's mechanical fasteners to ensure vibration isolation and optimal thermal grounding.
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Returns & Warranty
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| Country of origin |
United States
|
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