Description

Integrating advanced control capabilities within a compact, space-saving footprint, the FX5UC-64MT/D serves as a high-density, high-performance CPU module for the Mitsubishi Electric MELSEC iQ-F series. Designed to handle demanding automation tasks, this controller manages a total of 64 integrated I/O points, consisting of 32 digital inputs and 32 digital outputs.

The module is engineered with a high-density connector-type interface rather than traditional screw terminals, significantly reducing physical panel footprint and accelerating wire harness assembly. Operating on a 24 V DC input system, the controller features sink-type inputs paired with transistor sink-type outputs, offering rapid response times and high reliability for switching semiconductor and solid-state loads. With integrated system power supply capacities of 720 mA at 5 V DC and 500 mA at 24 V DC, it provides ample power to drive downstream expansion modules and communication adaptors.

Features

• High-Density Form Factor: Consolidates 64 I/O points within a slim housing, minimizing control panel space.
• Efficient Connections: Utilizes connector-type I/O ports for swift plug-and-play wiring installation.
• Sink Type I/O: Configured with 24 V DC sink inputs and durable transistor sink outputs.
• Integrated Power Reserves: Supplies 720 mA (5 V DC) and 500 mA (24 V DC) for connected system expansion.
• Industrial Processing Power: Delivers execution speeds and memory capacity characteristic of the MELSEC iQ-F logic platform.

Applications

• High-speed packaging and sorting machinery
• Multi-axis pick-and-place robotic systems
• Semiconductor manufacturing and assembly lines
• Automated material handling and conveyor networks
• Precision liquid-handling and process skid automation

Technical Specifications

Installation Guidelines

• Mounting: Install directly onto a standard 35 mm DIN rail in a horizontal orientation. Ensure the locking tabs are fully engaged to prevent vibration displacement.
• Ventilation Clearance: Maintain a minimum of 50 mm clearance above and below the CPU module to facilitate natural convection cooling.
• I/O Connections: Use compatible multi-pin connector sockets and designated crimp terminals. Ensure all power supplies are deactivated before mating or unmating the terminal connectors.
• Grounding: Connect a low-impedance functional ground wire (Class D grounding, resistance of 100 ohms or less) directly to the system's central grounding point.