Manufacturer: Mitsubishi Electric
Product No.: L26CPU-CM
Country of origin:United States
Product Type: PLC CPU Modules
Payment: T/T, Western Union
Weight: 3000g
Dimensions: 150 mm x 110 mm x 100 mm
Shipping port: Xiamen
Warranty: 12 months
Executing complex sequence logic with nanosecond-level processing efficiency, the Mitsubishi Electric L26CPU-CM serves as a high-density, rack-free controller within the MELSEC L Series platform. This central processing unit eliminates the need for a traditional backplane, utilizing integrated slide-locks for module-to-module mechanical coupling. It comes equipped with a built-in CC-Link master/local station interface, enabling immediate integration of distributed remote I/O points, variable frequency drives, and process sensors directly from the CPU. High-capacity memory reserves of 1040K bytes for programs and 768K bytes of standard RAM support elaborate mathematical operations, logging functionality, and recipe management in space-constrained industrial control panels.
| Manufacturer | Mitsubishi Electric |
|---|---|
| Model Identifier | L26CPU-CM |
| Product Series | MELSEC L Series |
| Program Memory Capacity | 1040K bytes (260K steps) |
| Standard RAM | 768K bytes |
| Standard ROM | 2048K bytes |
| Embedded Interfaces | CC-Link (Master/Local), USB, SD Memory Card Slot |
| File Register Size | 384K points |
| Country of Origin | Japan |
| Shipping Weight (Calculated) | 3.0 kg (including protective packaging) |
| Package Dimensions (Calculated) | 150 mm x 110 mm x 100 mm |
The L26CPU-CM provides direct physical integration with all MELSEC L Series expansion hardware. Note that when migrating code from basic modules like the L02CPU, you must adjust the I/O assignment configuration within GX Works2 to account for the integrated CC-Link network address space. This model serves as an excellent replacement for legacy standalone network architectures by merging logic control and network master functions into a single processing node.
To maintain proper thermal convection, do not restrict the top and bottom airflow passages of the L26CPU-CM housing. When installed inside unventilated enclosures subject to ambient operating temperatures exceeding 45 degC, maintain at least 50mm clearance above the CPU module. High CPU loading coupled with high-speed CC-Link polling can elevate internal components near thermal trip levels if clearance is obstructed.
Always verify that terminating resistors (110 ohm or 130 ohm depending on cable specifications) are physically wired across the DA and DB terminals of the physical end stations on the CC-Link network. Improper termination leads to immediate network frame drops and intermittent communication error flags. Ground the shielded connection of the CC-Link cable to the cabinet's protective earth ground plate at a single terminal point to prevent ground loop noise from corrupting data frames.
De-energize all primary and secondary power distribution lines before executing any installation, module coupling, or wiring procedures. Handling the CPU module or its modular expansions while powered can result in electrical shock, irreversible backplane link driver damage, and erratic PLC control behavior.
Mount the CPU module directly onto a clean, grounded DIN rail (DIN type TH35-7.5) or standard rear panel mounting surface.
Connect adjacently positioned expansion modules by sliding them along the joint guide slots until the locking levers click firmly into the locked position.
Establish system grounding by connecting a dedicated 2 mm square ground wire from the Functional Ground (FG) terminal directly to the enclosure main star ground.
Insert a verified SD memory card containing the runtime program, configure CC-Link network terminations, and slowly apply the designated system input voltage.
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| Country of origin |
United States
|
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