Product Overview and Thermal Monitoring Utility
The X67AT1322 (X67 AT 1322) is a high-performance, decentralized temperature acquisition module designed for the B&R X67 system. Engineered for "field-level" installation, this module allows for the direct connection of thermal sensors without the need for an IP20 control cabinet. Featuring 4 universal inputs, it supports a wide range of resistance temperature sensors including PT100, PT1000, KTY10-6, and KTY84-130. This flexibility makes it indispensable in plastic extrusion, engine monitoring, and HVAC applications where precise thermal feedback is critical for process stability. By digitizing signals at the point of measurement, the X67AT1322 eliminates long analog cable runs, effectively reducing electromagnetic interference and ensuring superior data integrity in harsh industrial environments.
Hardware Architecture and Signal Processing
The module is housed in a rugged, fully encapsulated casing that withstands high mechanical stress. The internal electronics are powered by a 24 VDC nominal supply, with a robust operating range of 18 to 30 VDC to accommodate fluctuations in industrial power grids.
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Sensor Compatibility: The 4-channel architecture is optimized for resistance-based measurement, providing high-resolution data for both standard RTDs and KTY-series silicon sensors.
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Protection Circuitry: Integrated reverse polarity protection prevents hardware failure during installation errors, ensuring long-term operational reliability.
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Decentralized Efficiency: As part of the X67 line, this module connects via the system bus to provide rapid temperature updates to the master controller with minimal bus cycle impact.
Technical Specifications
| Specification |
Details |
| Model |
X67AT1322 |
| Brand |
B&R (Bernecker + Rainer) |
| Module Type |
Temperature Input Module (RTD) |
| Number of Inputs |
4 (KTY10, KTY84, PT100, PT1000) |
| Nominal Voltage |
24 VDC |
| Voltage Range |
18 to 30 VDC |
| Operating Temp |
-25 to 60 Celsius |
| Storage Temp |
-40 to 85 Celsius |
| Protection |
Integrated Reverse Polarity Protection |
| Approx Weight |
200 g (Net) / 1.0 kg (Shipping) |
Integrated Technical FAQ
How does the module distinguish between different sensor types like PT100 and KTY84?
The sensor type is configured via the B&R Automation Studio software. Users must map the hardware channels to the specific sensor characteristic curve in the I/O configuration to ensure accurate temperature linearized values.
Can this module be used in outdoor or high-moisture environments?
Yes, the X67 series is designed for IP67-rated environments. When all M12 connections are properly tightened and unused ports are sealed, the X67AT1322 provides full protection against dust and water ingress, making it suitable for mounting directly on machinery.
Is there an internal diagnostic for sensor failure?
The module monitors for "Open Circuit" and "Short Circuit" conditions. If a sensor wire is broken or shorted, the diagnostic bit is set in the software register, allowing the PLC to trigger a safe-state routine or alarm.
Engineering & Installation Protocols
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Shielding and Grounding: For high-accuracy RTD measurements, always use shielded sensor cables. The shield should be connected to the M12 connector housing to provide a continuous path to the machine ground, minimizing the impact of 50/60 Hz noise on the measurement.
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M12 Connector Torque: To maintain the IP67 integrity, M12 connectors should be tightened to a torque of 0.6 Nm. Over-tightening can damage the internal O-ring, while under-tightening may lead to moisture-induced signal drift.
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Voltage Drops: In long X67 chains, monitor the voltage at the last module. Ensure it remains above 18 VDC under full load to maintain the accuracy of the internal Analog-to-Digital conversion.
Engineering Advantages
The X67AT1322 excels in modular machine building. Because the module is compact (200 g) and requires no cabinet space, engineers can add temperature zones to a machine without redesigning the electrical enclosure. Its wide operating temperature range (-25 to 60 Celsius) allows for deployment in cold storage facilities as well as near high-heat processing units, providing a unified hardware platform for diverse thermal monitoring needs.