Honeywell MC-PAIL02 51304481-150 yuqori unumdorlikdagi jarayon boshqaruvchisi past darajali analog kirish moduli

SKU MC-PAIL02

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Manufacturer: Honeywell
Product No.: MC-PAIL02
Country of origin:United States
Product Type: Past darajadagi analog kirish IOP modullari
Payment: T/T, Western Union
Weight: 500g
Dimensions: 300 mm x 220 mm x 25 mm (B x E x Ch)
Shipping port: Xiamen
Warranty: 12 months

Tavsif

Honeywell MC-PAIL02 (51304481-150) - TotalPlant Solution (TPS) va TDC 3000 boshqaruv tizimlaridagi High-Performance Process Manager (HPM) quyi tizimi uchun mo‘ljallangan, konform qoplamali Low Level Analog Input (LLAI) Input/Output Processor (IOP) kartasidir. U dala asbob-uskunalarini quyi tizim kontrolleri bilan ulash uchun signallarni qayta ishlaydi. MC-PAIL02 kartasi past darajadagi analog signallarni, jumladan Thermocouples (TC), Resistance Temperature Detectors (RTD) va millivolt manbalarini, shuningdek 0-5 V kuchlanish manbalari va 4-20 mA tok kontur qurilmalari kabi yuqori darajadagi kirishlarni qabul qiladi. Qattiq va korroziyali sanoat muhitlarida himoya ta’minlaydigan konform qoplamaga ega ushbu modul High-Performance Process Manager Modules (HPMM) bilan I/O Link Interface orqali aloqa qiladi. Signal kanallari bir-biridan va HPM mantiqiy tizimidan izolyatsiyalangan bo‘lib, dala simlari ekranlarining ulanishi uchun maxsus umumiy shinadan foydalanadi.

Xususiyatlari

Thermocouples (TC), Resistance Temperature Detectors (RTD) va millivolt (mV) manbalarini o‘z ichiga olgan past darajadagi analog kirishlarni qo‘llab-quvvatlaydi.
0-5 V kuchlanish manbalari va 4-20 mA tok konturlarini o‘z ichiga olgan yuqori darajadagi analog kirishlarni qabul qiladi.
Signal yaxlitligi va shovqinga chidamlilik uchun kanal-kanal va kanal-HPM mantiqiy izolyatsiyasi.
Qattiq muhit sharoitlarida foydalanish uchun mos konform qoplamali bosma plata yig‘masi (MC prefiksli).
7-Slot yoki 15-Slot High-Performance Process Manager IOP karta fayllariga o‘rnatiladi.
High-Performance Process Manager Modules (HPMM) bilan yuqori tezlikdagi I/O Link Interface orqali aloqa qiladi.
Jarayon dala simlari ekranlarini yerga ulash uchun umumiy shina tuzilmasi.

Qo‘llanilishi

Jarayon korxonalarida Thermocouples va RTD yordamida haroratni o‘lchash.
DCS tizimlarida millivolt va tok konturi signallarini monitoring qilish.
Honeywell High-Performance Process Manager (HPM) avtomatlashtirish arxitekturalarida analog kirishlarni qayta ishlash.
Konform qoplamali modullar talab qilinadigan qattiq yoki korroziyali jarayon hududlarida I/O integratsiyasi.

Buyurtma ma’lumotlari

Detal raqami	Model raqami	Tavsif	Qoplama turi
51304481-150	MC-PAIL02	Low Level Analog Input (LLAI) IOP Module	Konform
51304481-100	MU-PAIL02	Low Level Analog Input (LLAI) IOP Module	Konformsiz

Texnik xususiyatlar

Parametr	Spetsifikatsiya
Ishlab chiqaruvchi	Honeywell
Model raqami	MC-PAIL02
Detal raqami	51304481-150
Modul turi	Low Level Analog Input (LLAI) Input/Output Processor (IOP)
Arxitektura mosligi	High-Performance Process Manager (HPM) / TPS / TDC 3000
Past darajadagi signal kirishlari	Thermocouples (TC), Resistance Temperature Detectors (RTD), Millivolt (mV) manbalari
Yuqori darajadagi signal kirishlari	0-5 VDC kuchlanish manbalari, 4-20 mA tok konturlari
Signal kanallari izolyatsiyasi	Bir-biridan va HPM mantiqiy tizimidan izolyatsiyalangan; dala ekranlari uchun umumiy shina
Yig‘ma himoyasi	Konform qoplama (MC Series)
Karta fayliga mosligi	7-Slot va 15-Slot HPM / IOP karta fayllari
Shina interfeysi	I/O Link Interface

O‘rnatish bo‘yicha ko‘rsatmalar

Slotga joylashtirish: MC-PAIL02 modulini 7-Slot yoki 15-Slot IOP karta faylidagi bo‘sh slotga joylashtiring.
Ekranni yerga ulash: Elektromagnit shovqin va xalaqitlarni kamaytirish uchun dala simlari ekranlarini umumiy ekran shinasiга ulang.
ESD bilan ishlash: Plata yig‘masini ushlash va o‘rnatishda standart ESD ehtiyot choralariga va himoya yerga ulash talablariga rioya qiling.
Ulash: Mos keluvchi Field Termination Assemblies (FTAs) va Honeywell interfeys kabellari yordamida dala ulanish nuqtalariga ulang.

Muvofiqlik va sertifikatlar

CE talablariga muvofiq (CE talablariga muvofiq karta fayllari va shkaf korpuslariga o‘rnatilganda)
Division 2 xavfli hududlarida foydalanish uchun tasdiqlangan (tasdiqlangan HPM shkafi konfiguratsiyalariga integratsiya qilinganda)

FAQ

Honeywell MC-PAIL02 51304481-150 nima uchun ishlatiladi?

Honeywell MC-PAIL02 51304481-150 - termoparalar, RTDlar, millivolt manbalari va 0-5V/4-20mA signallarini High-Performance Process Manager quyi tizimiga ulash uchun ishlatiladigan konformal qoplamali past darajali analog kirish (LLAI) kirish/chiqish protsessori (IOP) kartasidir.

MC-PAIL02 LLAI moduli qaysi signal turlarini qo‘llab-quvvatlaydi?

Modul termoparalar (TC), qarshilikli harorat datchiklari (RTD) va millivolt manbalari kabi past darajali kirishlarni, shuningdek 0-5 V kuchlanish manbalari va 4-20 mA tok halqalari kabi yuqori darajali kirishlarni qo‘llab-quvvatlaydi.

Honeywell MC-PAIL02 va MU-PAIL02 o‘rtasidagi farq nimada?

MC-PAIL02 modeli og‘ir sanoat muhitlarida korroziyadan himoyalanish uchun konformal qoplamaga ega, MU-PAIL02 esa konformal qoplamasiz.

Qaysi karta fayllari MC-PAIL02 IOP kartasi bilan mos keladi?

MC-PAIL02 kartasi to‘g‘ridan-to‘g‘ri 7 slotli va 15 slotli High-Performance Process Manager (HPM) yoki IOP karta fayllaridagi karta slotlariga o‘rnatiladi.

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12-Month Warranty: Every industrial component is backed by our technical warranty.

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Global Express Shipping

Standard Delivery: 4-6 Business Days via DHL, FedEx, and UPS.
Express Dispatch: Same-day dispatch for in-stock orders placed before 2:00 PM (GMT+8).
Worldwide Coverage: Serving over 150 countries, including rapid delivery to Saudi Arabia and UAE.

Returns & Warranty

30-Day Guarantee: Returns accepted for in-stock products in original, factory-sealed packaging.
12-Month Warranty: Every industrial component is backed by our professional technical warranty.

Orders are processed and delivered Monday-Friday (excluding public holidays).

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TECHNICAL SPECIFICATIONS

Color pattern	Green
Country of origin	United States
Power source	DC Power