Allen-Bradley 1785-V40L PLC-5/VME Processor Module

The 1785-V40L is a PLC-5/VME processor module designed to facilitate advanced, high-density industrial control within automated manufacturing and production setups. Operating within the dependable PLC 5 product line, this module combines the proven execution capabilities of industrial programmable controllers with direct integration into host backplane architectures. The 1785-V40L provides substantial user memory capacity and rapid program scan metrics, making it well-suited for controlling large numbers of local and remote I/O chassis while executing intricate bit logic routines.

Features

• Equipped with 48,000 words of dedicated user memory to comfortably support large application codebases and data table allocations
• High-performance processing speeds featuring a scan rate of 0.5 milliseconds per 1,000 words for bit logic operations
• Broad system scaling capabilities accommodating up to 15 physical I/O racks and a total capacity of 1920 mixed inputs and outputs
• Flexible distributed networking capabilities with support for up to 16 extended local I/O chassis and up to 60 remote I/O chassis
• Configurable field communication interface providing multiple Data Highway Plus (DH+) or Remote I/O (RIO) networking selections

Applications

• High-density digital and analog factory automation systems
• Multi-chassis remote distributed control networks
• Large-scale data acquisition and sequence processing
• Modernization or integration of legacy embedded plant computing systems

Technical Specifications

Installation Guidelines

• Power Allocation: Verify that the system backplane power source can sustain the maximum current load rating of 3.5 Amperes before turning on the device.
• Network Termination: For Remote I/O (RIO) networks running at 57.6 kbps, 115.2 kbps, or 230 kbps, install matching termination resistors at the ends of the physical lines to maintain clean communication signals.
• Chassis Grounding: Maintain a direct, solid connection to a low-impedance common earth ground across the entire enclosure assembly to protect logic components against electronic noise and electromagnetic interference (EMI).
• Thermal Management: Arrange internal system wiring and keep ventilation tracks unobstructed to dissipate thermal energy effectively when the processor runs under dense typical current conditions.