Hersteller: Honeywell
Produkt-Nr.: 2MLK-CPUS-CC
Herkunftsland:Vereinigte Staaten
Produkttyp: PLC CPU Modules
Zahlung: T/T, Western Union
Gewicht: 2000g
Abmessungen: 160 mm x 120 mm x 100 mm
Versandhafen: Xiamen
Garantie: 12 Monate
Designed for high-reliability sequence control in legacy and process automation architectures, the Honeywell 2MLK-CPUS-CC serves as a robust central processing unit within the Master-K control platform. This standard CPU module features a 32kstep programming capacity and supports a maximum configuration of up to 3,072 I/O points. Programmed via non-IEC instruction structures, it delivers rapid logic execution and dependable diagnostic capabilities. The -CC designation indicates that the assembly is treated with high-grade conformal coating, ensuring superior protection against airborne moisture, dust, and corrosive chemical environments typical of heavy industrial zones.
| Manufacturer | Honeywell |
| Model Number | 2MLK-CPUS-CC |
| Series Name | Master-K Series |
| Program Capacity | 32k steps |
| Maximum I/O Capacity | 3,072 points |
| Programming Type | Non-IEC (Standard Ladder Logic) |
| Conformal Coating | Yes (CC-rated) |
| Operating Temperature | 0 to 55 degC |
| Shipping Weight (Calculated) | 2.0 kg |
| Package Dimensions (Calculated) | 160 mm x 120 mm x 100 mm |
| Interface Type | Connection Port | Functional Assignment |
|---|---|---|
| RS-232C Channel | D-Sub 9-pin | Local Loader/HMI Programming Link |
| RS-422/485 Channel | Terminal Block Interface | Multi-drop Peer-to-Peer Network Communication |
The 2MLK-CPUS-CC functions as a direct drop-in replacement for the standard, non-coated 2MLK-CPUS controller module. While execution times and memory allocations remain identical, the conformal-coated variant must be selected for replacement inside locations with elevated ambient humidity or sulfurous gas concentrations. Programs generated in KGLWIN for standard Master-K CPUs can be loaded directly into this coated variant without logic restructuring or compilation modifications.
Ensure that logic memory parameters remain within the 32kstep physical threshold. Although physical installation matches the standard module envelope, the conformal coating layer slightly limits heat dissipation rate compared to non-coated builds. Maintain active cooling or ample venting spacing if the local enclosure is subject to internal temperatures hovering near the upper thermal boundary of 55 degC.
When terminating RS-422/485 serial communication lines on the terminal block, utilize shielded twisted pair (STP) cabling to isolate low-voltage logic signals from high-induction motor lines. Connect the cable shield directly to the central panel earth ground at only one end to prevent ground loop currents from destabilizing serial communications during variable frequency drive operations.
CRITICAL WARNING
Isolate and disconnect all active industrial power lines feeding the PLC backplane prior to card installation or extraction. Hot-swapping the CPU module risks internal latch-up, memory corruption, and permanent destruction of system components.
Ensure the base unit is free of power and verify that the backplane connector pin-path is clean and free of contamination.
Align the module guides with the base plate slots and push firmly until the lock clip clicks into place.
Tighten any external mechanical retaining screws to a torque not exceeding 0.4 Nm, then connect serial communication cables securely.
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| Country of origin |
Vereinigte Staaten
|
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