Fabricant : Honeywell
N° de produit : HC900-900R04-0200
Pays d'origine :États-Unis
Type de produit : Hybrid Controller Racks
Paiement : Virement bancaire, Western Union
Poids : 4000g
Dimensions : 31.0 cm x 18.0 cm x 20.0 cm
Port d'expédition : Xiamen
Garantie : 12 mois
Engineered for seamless integration into distributed process control architectures, the Honeywell HC900-900R04-0200 serves as a rugged 4-slot I/O rack within the Honeywell HC900 Hybrid Controller system. This chassis provides the vital physical and electrical backplane interface, enabling high-speed communication between Honeywell input/output modules and the central processing unit. Designed for reliable signal routing and structural stability, this module-mounting rack is built to handle the rigorous demands of process and safety-critical environments.
| Parameter | Value / Specification |
|---|---|
| Manufacturer | Honeywell |
| Model/Article Number | HC900-900R04-0200 |
| Series Compatibility | HC900 Hybrid Controller System |
| I/O Slot Capacity | 4 Slots |
| Mounting Options | Panel Mount or Standard DIN Rail |
| Operating Temperature Limit | 0 to 60 degC |
| Storage Temperature Limit | -40 to 85 degC |
| Relative Humidity | 10% to 90% RH (non-condensing) |
| Shipping Weight (Calculated) | 4.0 kg (8.82 lbs) |
| Package Dimensions (Calculated) | 31.0 cm x 18.0 cm x 20.0 cm |
| Connector / Interface | Function / Circuit Assignment |
|---|---|
| Module Slots 1 through 4 | Proprietary internal parallel bus for Honeywell HC900 series I/O modules |
| Power Input Slot | Dedicated connector interface for 900P01 / 900P02 power supply modules |
| Chassis Grounding Bolt | Low-impedance earth ground connection for protective shielding and noise reduction |
The HC900-900R04-0200 backplane chassis is directly compatible with standard HC900 controllers including C30, C50, and C70 CPUs. When planning a migration or upgrade from older 900R04 legacy hardware configurations, ensure that any existing 900P01/900P02 power supplies and input/output module physical profiles align correctly. Some high-density analog modules may require a system firmware review on the host controller to guarantee full diagnostic visibility across the backplane.
To prevent thermal accumulation when populating high-power analog input or output modules within all four slots, a minimum convective clearance of 50mm (2 inches) must be left unobstructed above and below the rack chassis inside the control enclosure. Operating the backplane close to its maximum temperature of 60 degC without adequate ventilation can lead to localized heat buildup, reducing the operational lifespan of the installed power supplies and active field-wire modules.
Ensure the physical metal chassis is bonded directly to the main cabinet subpanel using a heavy-gauge, low-impedance ground strap. While many HC900 system components support hot-swapping under controlled circumstances, always refer to your specific control strategy documentation before removing modules from the active backplane to prevent safety-interlock trips or bus communications interruptions.
Isolate and lock out all external power sources before mounting, unmounting, or making connection changes to this rack assembly. Failure to completely de-energize primary and auxiliary power lines before physically installing or servicing the backplane can cause terminal arc flashes, permanent hardware damage, or severe operator injury.
Mount the chassis onto a standard DIN rail or bolt it securely to the enclosure's metal subpanel using the integrated mounting brackets.
Connect a dedicated earth ground lead to the chassis ground screw, verifying that low contact resistance is achieved.
Slide the designated power supply module into its assigned slot and tighten its physical retention screws.
Carefully align and insert the desired I/O modules into slots 1 through 4, ensuring full seat connection before securing the module retention screws.
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| Country of origin |
États-Unis
|
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