Mitsubishi Electric Q172DSCPU MELSEC-Q Series Motion Controller

Description

The Q172DSCPU serves as a high-performance motion CPU module designed specifically for the Mitsubishi Electric MELSEC-Q Series PLC platform. Operating as a dedicated motion controller, this unit manages up to 16 axes of synchronized motion, executing complex positioning, interpolation, and speed-torque control profiles. By integrating directly onto the MELSEC-Q series backplane, the Q172DSCPU coordinates seamlessly with sequence CPUs in a multi-CPU configuration, optimizing processing throughput for automated systems.

Equipped with a dedicated motion operating system, this module supports advanced programming capabilities including virtual mechanical systems, electronic cams, and electronic gears. The module features integrated hardware interfaces for high-speed synchronization, including a built-in emergency stop input and general-purpose input signals, ensuring deterministic response times and robust safety control directly at the hardware layer.

Features

• Coordinates up to 16 axes of motion control per CPU module.
• Provides a servo program capacity of 16k steps for complex motion profiling.
• Supports up to 3200 positioning points with direct or indirect specification capabilities.
• Equipped with photocoupler-isolated general-purpose inputs (4 points) and emergency stop input (1 point) for localized safety execution.
• Integrates within the MELSEC-Q series multi-CPU architecture, supporting up to 256 I/O points and 256 analog points per CPU.
• Connects to up to 7 extension base stages for scalable system layouts.

Applications

• Multi-axis packaging and wrapping machinery
• High-precision semiconductor and flat-panel display manufacturing
• Automated assembly systems and pick-and-place robotics
• Automotive metal stamping and transfer lines

Technical Specifications

Connections and Interfaces

Installation Guidelines

• Mount the module securely onto a compatible MELSEC-Q series main base unit. Ensure the locking latch engages correctly.
• Provide adequate ventilation clearance around the CPU unit, keeping at least 30 mm of clearance above and below the module rack.
• Ensure correct grounding of the base unit's LG and FG terminals using a dedicated class D ground (ground resistance of 100 ohms or less).
• Route external I/O and emergency stop signal lines away from high-voltage motor power cables to prevent electromagnetic interference.

Compliance and Certifications

• CE Marked (EMC and Low Voltage Directives)
• UL / cUL Listed
• KC (Korean Certification)