Description

Designed for versatile, mid-size automation control, the L26CPU-BT-CM serves as a core high-performance CPU module within the Mitsubishi Electric MELSEC-L series. Operating without a conventional base plate, this rackless, modular controller connects directly to expansion units to minimize panel footprint while maintaining reliable communication interfaces. The processing unit supports advanced mathematical functions, high-speed sequence execution, and structured programming, making it highly effective for distributed control architectures and stand-alone machinery.

This controller incorporates dedicated high-capacity storage areas, handling complex automation tasks with a program memory allocation of 1040K bytes. It supports fast data logging, built-in communication protocols, and direct connection options, ensuring efficient integration into modern industrial networks.

Features

• Rackless Modular Design: Eliminates the need for a physical backplane, enabling direct coupling of CPU and expansion I/O modules.
• Substantial Execution Storage: Equipped with 1040K bytes of program memory, 768K bytes of standard RAM, and 2048K bytes of standard ROM.
• Granular Memory Management: Optimizes data utilization with precise allocation sizes down to 1 step (4 bytes) for program memory.
• Integrated Communication: Built-in ports facilitate networking with other controllers and human-machine interfaces without auxiliary hardware.
• Diagnostics and Maintenance: Built-in system statuses and self-diagnostic features alert operators to sequence errors or hardware faults.

Applications

• Packaging and labeling machinery.
• Water and wastewater municipal processing plants.
• Conveyor systems and high-speed material handling.
• HVAC and environmental control automation.

Technical Specifications

Installation Guidelines

• Mounting: Install directly onto a standard 35mm DIN rail. Ensure security hooks are locked to prevent movement.
• Grounding: Connect the ground terminal using a dedicated Class D ground cable (ground resistance of 100 ohms or less) to minimize electromagnetic interference.
• Thermal Management: Maintain a minimum clearance of 30mm above and below the module to promote natural convection and prevent heat buildup.
• Wiring: Always de-energize the system power supply before attaching or removing terminal blocks or communication cables.