Honeywell

Honeywell MC-PAIL02 51304481-150 High-Performance Process Manager Low Level Analog Input Module

SKU MC-PAIL02

In stock
  • 12-month warranty
  • Free returns within 30 days
  • Manufacturer: Honeywell

  • Product No.: MC-PAIL02

  • Country of origin:United States

  • Product Type: Low Level Analog Input IOP Modules

  • Payment: T/T, Western Union

  • Weight: 500g

  • Dimensions: 300 mm x 220 mm x 25 mm (H x W x D)

  • Shipping port: Xiamen

  • Warranty: 12 months

Description

The Honeywell MC-PAIL02 (51304481-150) is a conformally coated Low Level Analog Input (LLAI) Input/Output Processor (IOP) card designed for the High-Performance Process Manager (HPM) subsystem in TotalPlant Solution (TPS) and TDC 3000 control systems. It provides signal processing to interface field instrumentation with the subsystem controller. The MC-PAIL02 card accepts low-level analog signals, including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt sources, as well as high-level inputs such as 0-5 V voltage sources and 4-20 mA current loop devices. Featuring conformal coating for protection in harsh and corrosive industrial environments, the module communicates with High-Performance Process Manager Modules (HPMM) across the I/O Link Interface. Signal channels are isolated from each other and from the HPM logic, utilizing a dedicated common bus for field wire shield terminations.

Features

  • Supports low-level analog inputs including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt (mV) sources.
  • Accepts high-level analog inputs including 0-5 V voltage sources and 4-20 mA current loops.
  • Channel-to-channel and channel-to-HPM logic isolation for signal integrity and noise immunity.
  • Conformally coated printed circuit board assembly (MC prefix) suitable for harsh environmental conditions.
  • Installs into 7-Slot or 15-Slot High-Performance Process Manager IOP card files.
  • Communicates with High-Performance Process Manager Modules (HPMM) via the high-speed I/O Link Interface.
  • Common bus structure for process field wire shield grounding.

Applications

  • Temperature measurement using Thermocouples and RTDs in process plant environments.
  • Millivolt and current loop signal monitoring in DCS systems.
  • Analog input processing in Honeywell High-Performance Process Manager (HPM) automation architectures.
  • I/O integration in harsh or corrosive process locations requiring conformally coated modules.

Ordering Information

Part Number Model Number Description Coating Type
51304481-150 MC-PAIL02 Low Level Analog Input (LLAI) IOP Module Conformal
51304481-100 MU-PAIL02 Low Level Analog Input (LLAI) IOP Module Non-Conformal

Technical Specifications

Parameter Specification
Manufacturer Honeywell
Model Number MC-PAIL02
Part Number 51304481-150
Module Type Low Level Analog Input (LLAI) Input/Output Processor (IOP)
Architecture Compatibility High-Performance Process Manager (HPM) / TPS / TDC 3000
Low Level Signal Inputs Thermocouples (TC), Resistance Temperature Detectors (RTD), Millivolt (mV) sources
High Level Signal Inputs 0-5 VDC voltage sources, 4-20 mA current loops
Signal Channel Isolation Isolated from each other and HPM logic; common bus for field shields
Assembly Protection Conformal Coating (MC Series)
Card File Compatibility 7-Slot and 15-Slot HPM / IOP Card Files
Bus Interface I/O Link Interface

Installation Guidelines

  • Slot Placement: Insert the MC-PAIL02 module into an available slot within a 7-Slot or 15-Slot IOP card file.
  • Shield Grounding: Connect field wire shields to the common shield bus to minimize electromagnetic noise and interference.
  • ESD Handling: Use standard ESD precautions and protective grounding when handling and installing the circuit board assembly.
  • Interfacing: Connect to field termination points using compatible Field Termination Assemblies (FTAs) and Honeywell interface cables.

Compliance and Certifications

  • CE Compliant (when installed in CE-compliant card files and cabinet enclosures)
  • Approved for use in Division 2 hazardous locations (when integrated into approved HPM cabinet configurations)

FAQ

What is the Honeywell MC-PAIL02 51304481-150 used for?

The Honeywell MC-PAIL02 51304481-150 is a conformally coated Low Level Analog Input (LLAI) Input/Output Processor (IOP) card used to interface thermocouples, RTDs, millivolt sources, and 0-5V/4-20mA signals with the High-Performance Process Manager subsystem.

Which signal types are supported by the MC-PAIL02 LLAI module?

The module supports low-level inputs such as thermocouples (TC), resistance temperature detectors (RTD), and millivolt sources, as well as high-level inputs including 0-5 V voltage sources and 4-20 mA current loops.

What is the difference between Honeywell MC-PAIL02 and MU-PAIL02?

The MC-PAIL02 model features conformal coating for corrosion protection in harsh industrial environments, whereas the MU-PAIL02 is non-conformally coated.

Which card files are compatible with the MC-PAIL02 IOP card?

The MC-PAIL02 card installs directly into card slots within 7-Slot and 15-Slot High-Performance Process Manager (HPM) or IOP card files.

View all FAQs →

Product Documentation

Technical Datasheet (PDF) Complete specifications and technical drawings.

Technical Datasheet

Honeywell MC-PAIL02 51304481-150 High-Performance Process Manager Low Level Analog Input Module

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Global Express Shipping

  • Standard Delivery: 4-6 Business Days via DHL, FedEx, and UPS.
  • Express Dispatch: Same-day dispatch for in-stock orders placed before 2:00 PM (GMT+8).
  • Worldwide Coverage: Serving over 150 countries, including rapid delivery to Saudi Arabia and UAE.

Returns & Warranty

  • 30-Day Guarantee: Returns accepted for in-stock products in original, factory-sealed packaging.
  • 12-Month Warranty: Every industrial component is backed by our professional technical warranty.

Orders are processed and delivered Monday-Friday (excluding public holidays).


For full eligibility, restocking fees, and international return details, please view our official Refund & Return Policy .

TECHNICAL SPECIFICATIONS

Color pattern
Green
Country of origin
United States
Power source
DC Power

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