Honeywell MC-PAIL02 51304481-150 High-Performance Process Manager Low Level Analog Input Module
SKU MC-PAIL02
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12-month warranty
Free returns within 30 days
Manufacturer:
Honeywell
Product No.:
MC-PAIL02
Country of origin:United States
Product Type:
Low Level Analog Input IOP Modules
Payment:
T/T, Western Union
Weight:
500g
Dimensions:
300 mm x 220 mm x 25 mm (H x W x D)
Shipping port:
Xiamen
Warranty:
12 months
Description
The Honeywell MC-PAIL02 (51304481-150) is a conformally coated Low Level Analog Input (LLAI) Input/Output Processor (IOP) card designed for the High-Performance Process Manager (HPM) subsystem in TotalPlant Solution (TPS) and TDC 3000 control systems. It provides signal processing to interface field instrumentation with the subsystem controller. The MC-PAIL02 card accepts low-level analog signals, including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt sources, as well as high-level inputs such as 0-5 V voltage sources and 4-20 mA current loop devices. Featuring conformal coating for protection in harsh and corrosive industrial environments, the module communicates with High-Performance Process Manager Modules (HPMM) across the I/O Link Interface. Signal channels are isolated from each other and from the HPM logic, utilizing a dedicated common bus for field wire shield terminations.
Features
Supports low-level analog inputs including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt (mV) sources.
Accepts high-level analog inputs including 0-5 V voltage sources and 4-20 mA current loops.
Channel-to-channel and channel-to-HPM logic isolation for signal integrity and noise immunity.
Installs into 7-Slot or 15-Slot High-Performance Process Manager IOP card files.
Communicates with High-Performance Process Manager Modules (HPMM) via the high-speed I/O Link Interface.
Common bus structure for process field wire shield grounding.
Applications
Temperature measurement using Thermocouples and RTDs in process plant environments.
Millivolt and current loop signal monitoring in DCS systems.
Analog input processing in Honeywell High-Performance Process Manager (HPM) automation architectures.
I/O integration in harsh or corrosive process locations requiring conformally coated modules.
Ordering Information
Part Number
Model Number
Description
Coating Type
51304481-150
MC-PAIL02
Low Level Analog Input (LLAI) IOP Module
Conformal
51304481-100
MU-PAIL02
Low Level Analog Input (LLAI) IOP Module
Non-Conformal
Technical Specifications
Parameter
Specification
Manufacturer
Honeywell
Model Number
MC-PAIL02
Part Number
51304481-150
Module Type
Low Level Analog Input (LLAI) Input/Output Processor (IOP)
Architecture Compatibility
High-Performance Process Manager (HPM) / TPS / TDC 3000
Low Level Signal Inputs
Thermocouples (TC), Resistance Temperature Detectors (RTD), Millivolt (mV) sources
High Level Signal Inputs
0-5 VDC voltage sources, 4-20 mA current loops
Signal Channel Isolation
Isolated from each other and HPM logic; common bus for field shields
Assembly Protection
Conformal Coating (MC Series)
Card File Compatibility
7-Slot and 15-Slot HPM / IOP Card Files
Bus Interface
I/O Link Interface
Installation Guidelines
Slot Placement: Insert the MC-PAIL02 module into an available slot within a 7-Slot or 15-Slot IOP card file.
Shield Grounding: Connect field wire shields to the common shield bus to minimize electromagnetic noise and interference.
ESD Handling: Use standard ESD precautions and protective grounding when handling and installing the circuit board assembly.
Interfacing: Connect to field termination points using compatible Field Termination Assemblies (FTAs) and Honeywell interface cables.
Compliance and Certifications
CE Compliant (when installed in CE-compliant card files and cabinet enclosures)
Approved for use in Division 2 hazardous locations (when integrated into approved HPM cabinet configurations)
FAQ
What is the Honeywell MC-PAIL02 51304481-150 used for?
The Honeywell MC-PAIL02 51304481-150 is a conformally coated Low Level Analog Input (LLAI) Input/Output Processor (IOP) card used to interface thermocouples, RTDs, millivolt sources, and 0-5V/4-20mA signals with the High-Performance Process Manager subsystem.
Which signal types are supported by the MC-PAIL02 LLAI module?
The module supports low-level inputs such as thermocouples (TC), resistance temperature detectors (RTD), and millivolt sources, as well as high-level inputs including 0-5 V voltage sources and 4-20 mA current loops.
What is the difference between Honeywell MC-PAIL02 and MU-PAIL02?
The MC-PAIL02 model features conformal coating for corrosion protection in harsh industrial environments, whereas the MU-PAIL02 is non-conformally coated.
Which card files are compatible with the MC-PAIL02 IOP card?
The MC-PAIL02 card installs directly into card slots within 7-Slot and 15-Slot High-Performance Process Manager (HPM) or IOP card files.
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