Mitsubishi Electric GCU08BB-130 80173-109-01-2 GU-G08 Thyristor Unit

Q: What is the function of the GU-G08 assembly on this device?

The GU-G08 assembly serves as the dedicated integrated gate driver board, responsible for receiving fiber optic control inputs and executing high-speed current commutation to switch the GCT thyristor.

Q: What are the specific designations of the onboard LED indicators?

The board features four LEDs: LED4 indicates Power Supply OK (green), LED3 indicates G-K OK (green), LED2 indicates Gate ON (yellow), and LED1 indicates Gate OFF (red).

Q: What is the proper mounting force needed for installation?

The unit must be mounted using a press compression force between 11.1 kN and 15.8 kN, with a nominal configuration setting of 13 kN.

Q: Which fiber optic components are utilized for signal transmission?

The device utilizes an Agilent HFBR-2521 receiver for the incoming control signal and an Agilent HFBR-1521 transmitter for outputting the status/fault signal.

SKU GCU08BB-130 80173-109-01-2

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12-month warranty
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Manufacturer: Mitsubishi Electric
Product No.: GCU08BB-130 80173-109-01-2
Country of origin:United States
Product Type: Thyristor Unit
Barcode: 8537101190
Payment: T/T, Western Union
Weight: 1100g
Dimensions: 48 mm x 208 mm x 250 mm (H x W x D)
Shipping port: Xiamen
Warranty: 12 months

Description

The Mitsubishi Electric GCU08BB-130 is a high-power symmetrical Gate Commutated Turn-off (GCT) thyristor unit integrated with a dedicated GU-G08 gate driver board assembly, engineered specifically for high-power inverter use. This industrial press-pack type device features an optimized co-axial configuration where the GCT semiconductor and the gate driver are interconnected directly to achieve low-inductance gate commutation and robust noise immunity. The unit provides critical power management with a repetitive peak off-state voltage of 6500V and a repetitive controllable on-state current of 800A. Bearing the manufacturer identification 80173-109-01-2, the GCU08BB-130 delivers dependable solid-state switching for current source inverters, DC choppers, induction heaters, and DC to DC converters.

Features

Symmetrical GCT device layout with an integrated GU-G08 gate driver board for direct, low-inductance control.
Four built-in diagnostic LED indicators providing real-time operational feedback: POWER SUPPLY OK (Green), G-K OK (Green), GATE ON (Yellow), and GATE OFF (Red).
Integrated fiber optic control interface utilizing dedicated transmitter and receiver nodes to ensure electrical isolation and high immunity against electromagnetic interference (EMI).
Dual on-board test points (GATE TEST POINT and CATHODE TEST POINT) for straightforward field diagnostics and voltage verification.
High-voltage press-pack structure offering balanced thermal dissipation across the double-sided cooling surfaces under heavy mechanical clamping.

Applications

Current source inverters
DC choppers
Induction heaters
DC to DC converters

Technical Specifications

Electrical Ratings (GCT Part)

Parameter	Symbol	Conditions	Rating / Limit	Unit
Repetitive peak reverse voltage	VRRM	—	6500	V
Non-repetitive peak reverse voltage	VRSM	—	6500	V
Repetitive peak off-state voltage	VDRM	Gate driver energized	6500	V
Non-repetitive peak off-state voltage	VDSM	Gate driver energized	6500	V
Long term DC stability voltage	V(LTDS)	Gate driver energized, lambda = 100 Fit	3600	V
RMS on-state current	IT(RMS)	Applied for all condition angles	520	A
Average on-state current	IT(AV)	f = 60Hz sinewave, theta = 180 degrees, Tt = 62 degC	330	A
Repetitive controllable on-state current	ITQRM	VDM = 3/4 VDRM, VD = 3000V, LC = 0.3 uH, Tj = 25/125 degC	800	A
Surge on-state current	ITSM	One half cycle at 60Hz, Tj = 125 degC start	4.8	kA
Current-squared, time integration	I2t	One half cycle at 60Hz, Tj = 125 degC start	9.6 x 10^4	A2s
Critical rate of rise of on-state current	dit/dt	VD = 3000V, IT = 800A, Cs = 0.1 uF, Rs = 10 Ohm, Tj = 25/125 degC, f = 60Hz	1000	A/us
Critical rate of rise of reverse recovery current	dir/dt	IT = 800A, VA = 3000V, Tj = 25/125 degC, Cs = 0.1 uF, Rs = 10 Ohm	1000	A/us
Peak forward gate power dissipation	PFGM	—	5	kW
Peak reverse gate power dissipation	PRGM	—	17	kW
Average forward gate power dissipation	PFG(AV)	—	100	W
Average reverse gate power dissipation	PRG(AV)	—	120	W
Peak forward gate voltage	VFGM	—	10	V
Peak reverse gate voltage	VRGM	—	21	V
Peak forward gate current	IFGM	—	500	A
Peak reverse gate current	IRGM	—	800	A

Electrical Characteristics (GCT Part)

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
On-state voltage	VTM	IT = 400A, Tj = 125 degC	—	—	5.5	V
Repetitive peak reverse current	IRRM	VRM = 6500V, Tj = 125 degC	—	—	250	mA
Repetitive peak off-state current	IDRM	VDM = 6500V, Tj = 125 degC, Gate driver energized	—	—	100	mA
Reverse gate current	IGRM	VRG = 21V, Tj = 125 degC	—	—	40	mA
Critical rate of rise of off-state voltage	dv/dt	VD = 3000V, Tj = 125 degC, Gate driver energized (Expo. wave)	3000	—	—	V/us
Turn-on time	tgt	Tj = 125 degC, IT = 800A, VD = 3000V, Cs = 0.1 uF, Rs = 10 Ohm	—	—	5	us
Turn-on delay time	td	Tj = 125 degC, IT = 800A, VD = 3000V, Cs = 0.1 uF, Rs = 10 Ohm	—	—	1	us
Turn-on switching energy	Eon	IT = 400A, VD = 3000V, di/dt = 1000A/us, Cs = 0.1 uF, Rs = 10 Ohm, Tj = 125 degC	—	—	0.6	J/P
Storage time	ts	IT = 800A, VDM = 3/4 VDRM, VD = 3000V, Cs = 0.1 uF, Rs = 10 Ohm, Tj = 125 degC	—	—	3	us
Turn-off switching energy	Eoff	IT = 400A, VDM = 4000V, VD = 3000V, Cs = 0.1 uF, Rs = 10 Ohm, Tj = 125 degC	—	—	2.3	J/P
Reverse recovery charge	QRR	VA = 3000V, IT = 400A, di/dt = 1000A/us	—	—	1800	uC
Reverse recovery energy	Erec	Cs = 0.1 uF, Rs = 10 Ohm, Tj = 125 degC	—	—	4.4	J/P
Gate trigger current	IGT	VD = 24V, RL = 0.1 Ohm, Tj = 25 degC	—	—	0.5	A
Gate trigger voltage	VGT	DC method	—	—	1.5	V

Gate Driver Board Assembly (GU-G08 Part)

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Power supply voltage	VGIN	DC power supply input via Phoenix plug	19	20	21	V
Gate power consumption	PGIN	IT = 420Arms, f = 780Hz, duty = 0.33	—	—	35	W
Delay time of on gate current	tfd	Ta = 25 degC	—	—	3.0	us
Delay time of off gate current	trd	Ta = 25 degC	—	—	3.0	us

Mechanical and Environmental Data

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Mounting force	FM	Required compression clamping	11.1	13	15.8	kN
Weight	—	Base module mass	—	1100	—	g
Pole piece diameter	—	GCT component mating profile (±0.2mm)	—	47	—	mm
Housing thickness	—	GCT component thickness (±0.5mm)	—	26	—	mm
Junction operating temperature	Tj	Continuous operation	-10	—	125	degC
Storage temperature	Tstg	Ambient environment	-10	—	60	degC
Ambient operation temperature	Ta	Local enclosure air (Recommended <= 40 degC)	-10	—	60	degC
Junction to Fin thermal resistance	Rth(j-f)	Double-sided cooling configuration	—	—	0.025	K/W

Connections/Interfaces

Interface Component Assignments

Interface / Connector Name	Component / Type Identifier	Function
20V Power Supply Input	Phoenix Contact MSTB2.5/2-G-5.08AU	Main 20VDC power supply input for the gate driver board
Fiber Optic Input	Agilent HFBR-2521	Receiver port for external optical control pulse lines
Fault Signal Output	Agilent HFBR-1521	Transmitter port for optical feedback and driver status tracking
Gate Test Point	On-board Terminal Pin	Physical point for measuring gate potential
Cathode Test Point	On-board Terminal Pin	Physical point for measuring cathode potential

Installation Guidelines

Clamping Pressure Control: The press-pack assembly requires a strict mechanical force within 11.1 kN to 15.8 kN (Target: 13 kN). Improper mounting force degrades the internal interface thermal resistance and risks electrical failure under high current loads.
Control Power Parameters: Deliver a clean DC voltage profile between 19V and 21V directly to the 2-pin Phoenix plug header. Ensure power cabling satisfies continuous current demands without dropping below 19V during high-frequency gate charging.
Optical Data Link Rules: Ensure the fiber optic cables securely seat inside the Agilent HFBR-2521 and HFBR-1521 sub-assemblies. Maintain bend radiuses above the minimal mechanical thresholds to block light-attenuation errors.
Thermal Interface Execution: Coat the heatsink poles smoothly and evenly with high-performance thermal grease. The total thermal loop resistance from junction to fin must remain bound under 0.025 K/W.
Screw Clearance Safety: Limit the engagement depth of matching screws penetrating the thermal blocks or heatsink directly to between 6 mm and 8 mm to avoid distortion of the housing or board stress.

FAQ

What is the function of the GU-G08 assembly on this device?

The GU-G08 assembly serves as the dedicated integrated gate driver board, responsible for receiving fiber optic control inputs and executing high-speed current commutation to switch the GCT thyristor.

What are the specific designations of the onboard LED indicators?

The board features four LEDs: LED4 indicates Power Supply OK (green), LED3 indicates G-K OK (green), LED2 indicates Gate ON (yellow), and LED1 indicates Gate OFF (red).

What is the proper mounting force needed for installation?

The unit must be mounted using a press compression force between 11.1 kN and 15.8 kN, with a nominal configuration setting of 13 kN.

Which fiber optic components are utilized for signal transmission?

The device utilizes an Agilent HFBR-2521 receiver for the incoming control signal and an Agilent HFBR-1521 transmitter for outputting the status/fault signal.

View all FAQs →

Product Documentation

Technical Datasheet (PDF) Complete specifications and technical drawings.

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Global Express Shipping

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Express Dispatch: Same-day dispatch for in-stock orders placed before 2:00 PM (GMT+8).
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