Honeywell MC-PAIL02 51304481-150 High-Performance Process Manager Low Level Analog Input Module

SKU MC-PAIL02

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12-month warranty
Free returns within 30 days

Manufacturer: Honeywell
Product No.: MC-PAIL02
Origin United States
Product Type: Low Level Analog Input IOP Modules
Payment: T/T, Western Union
Weight: 0.5 kg
Dimensions: 300 mm x 220 mm x 25 mm (H x W x D)
Shipping port: Xiamen
Warranty: 12 months

Product Documentation

Technical Datasheet (PDF) Complete specifications and technical drawings.

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Product Description

Description

The Honeywell MC-PAIL02 (51304481-150) is a conformally coated Low Level Analog Input (LLAI) Input/Output Processor (IOP) card designed for the High-Performance Process Manager (HPM) subsystem in TotalPlant Solution (TPS) and TDC 3000 control systems. It provides signal processing to interface field instrumentation with the subsystem controller. The MC-PAIL02 card accepts low-level analog signals, including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt sources, as well as high-level inputs such as 0-5 V voltage sources and 4-20 mA current loop devices. Featuring conformal coating for protection in harsh and corrosive industrial environments, the module communicates with High-Performance Process Manager Modules (HPMM) across the I/O Link Interface. Signal channels are isolated from each other and from the HPM logic, utilizing a dedicated common bus for field wire shield terminations.

Features

Supports low-level analog inputs including Thermocouples (TC), Resistance Temperature Detectors (RTD), and millivolt (mV) sources.
Accepts high-level analog inputs including 0-5 V voltage sources and 4-20 mA current loops.
Channel-to-channel and channel-to-HPM logic isolation for signal integrity and noise immunity.
Conformally coated printed circuit board assembly (MC prefix) suitable for harsh environmental conditions.
Installs into 7-Slot or 15-Slot High-Performance Process Manager IOP card files.
Communicates with High-Performance Process Manager Modules (HPMM) via the high-speed I/O Link Interface.
Common bus structure for process field wire shield grounding.

Applications

Temperature measurement using Thermocouples and RTDs in process plant environments.
Millivolt and current loop signal monitoring in DCS systems.
Analog input processing in Honeywell High-Performance Process Manager (HPM) automation architectures.
I/O integration in harsh or corrosive process locations requiring conformally coated modules.

Ordering Information

Part Number	Model Number	Description	Coating Type
51304481-150	MC-PAIL02	Low Level Analog Input (LLAI) IOP Module	Conformal
51304481-100	MU-PAIL02	Low Level Analog Input (LLAI) IOP Module	Non-Conformal

Technical Specifications

Parameter	Specification
Manufacturer	Honeywell
Model Number	MC-PAIL02
Part Number	51304481-150
Module Type	Low Level Analog Input (LLAI) Input/Output Processor (IOP)
Architecture Compatibility	High-Performance Process Manager (HPM) / TPS / TDC 3000
Low Level Signal Inputs	Thermocouples (TC), Resistance Temperature Detectors (RTD), Millivolt (mV) sources
High Level Signal Inputs	0-5 VDC voltage sources, 4-20 mA current loops
Signal Channel Isolation	Isolated from each other and HPM logic; common bus for field shields
Assembly Protection	Conformal Coating (MC Series)
Card File Compatibility	7-Slot and 15-Slot HPM / IOP Card Files
Bus Interface	I/O Link Interface

Installation Guidelines

Slot Placement: Insert the MC-PAIL02 module into an available slot within a 7-Slot or 15-Slot IOP card file.
Shield Grounding: Connect field wire shields to the common shield bus to minimize electromagnetic noise and interference.
ESD Handling: Use standard ESD precautions and protective grounding when handling and installing the circuit board assembly.
Interfacing: Connect to field termination points using compatible Field Termination Assemblies (FTAs) and Honeywell interface cables.

Compliance and Certifications

CE Compliant (when installed in CE-compliant card files and cabinet enclosures)
Approved for use in Division 2 hazardous locations (when integrated into approved HPM cabinet configurations)

Shipping & Returns

Global Express Shipping

Standard Delivery: 4–6 business days via DHL, FedEx, and UPS.
Express Dispatch: Same-day dispatch for in-stock orders placed before 2:00 PM (GMT+8).
Worldwide Coverage: Serving over 150 countries.

Returns & Warranty

30-Day Guarantee: Returns accepted for in-stock products in original, factory-sealed packaging.
12-Month Warranty: Every industrial component is backed by our technical warranty.

FAQ

What is the Honeywell MC-PAIL02 51304481-150 used for?

The Honeywell MC-PAIL02 51304481-150 is a conformally coated Low Level Analog Input (LLAI) Input/Output Processor (IOP) card used to interface thermocouples, RTDs, millivolt sources, and 0-5V/4-20mA signals with the High-Performance Process Manager subsystem.

Which signal types are supported by the MC-PAIL02 LLAI module?

The module supports low-level inputs such as thermocouples (TC), resistance temperature detectors (RTD), and millivolt sources, as well as high-level inputs including 0-5 V voltage sources and 4-20 mA current loops.

What is the difference between Honeywell MC-PAIL02 and MU-PAIL02?

The MC-PAIL02 model features conformal coating for corrosion protection in harsh industrial environments, whereas the MU-PAIL02 is non-conformally coated.

Which card files are compatible with the MC-PAIL02 IOP card?

The MC-PAIL02 card installs directly into card slots within 7-Slot and 15-Slot High-Performance Process Manager (HPM) or IOP card files.

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