Tutto sui PLC: la CPU
A practical engineering guide to PLC CPU operation, from deterministic scan cycles and I/O image tables to memory, communications, diagnostics, redundancy, processor sizing, and reliable system...
Processing analog instrumentation signals in heavy industrial process environments, the Honeywell 51304718-200 operates as a high-reliability High Level Analog Input (HLAI) and Smart Transmitter Interface (STI) module. Engineered for integration with the legacy TDC 3000 and Experion process control architectures, this input/output processor card interfaces field-mounted transmitters directly with the control network. It functions by digitizing standard 1-5 VDC or 4-20 mA process variable loops, supporting dual-channel communication options to ensure precise loop execution and high-fidelity signal acquisition without data degradation.
| Parameter | Specification |
|---|---|
| Manufacturer | Honeywell |
| Part Number / SKU | 51304718-200 |
| Module Type | HLAI / STI (High Level Analog Input / Smart Transmitter Interface) |
| System Platform Compatibility | TDC 3000 / TPS / Experion systems |
| Input Types | 1-5 VDC, 4-20 mA (via external shunt resistors) |
| Operating Temperature | 0 to 60 degC |
| Shipping Weight (Calculated) | 3.00 kg |
| Package Dimensions (Calculated) | 32.0 x 24.0 x 6.5 cm |
The 51304718-200 revision incorporates enhanced component layout and trace isolation over older -100 series assemblies. It maintains full backplane physical footprint compatibility but may require checking existing card file software revisions to ensure the correct microcode is loaded. It operates directly with the matching Field Termination Assembly (FTA) models dedicated to High Level Analog Input functions.
When utilizing this module in high-density process cabinets, thermal load tracking is essential. Ensure that surrounding card slots have adequate air circulation to prevent local cabinet hotspots from exceeding the 60 degC threshold. Additionally, keep passive and active loops isolated at the field termination barrier to prevent common-mode voltage offsets on the analog ground bus.
During commissioning, ensure that the shield drain wires are terminated strictly at one end (ideally at the FTA chassis ground point) to avoid creating ground loops. If field-side calibration drift is suspected, verify the integrity of the external shunt resistors on the terminal block before attempting to adjust the card software scaling values.
Disconnect all electrical power paths leading to the card file chassis before inserting or pulling the module. Hot-plugging a card into an unstable backplane or during active communication cycles can cause process disruptions, loop diagnostic faults, or component stress. Always ground yourself using an ESD wrist strap during handling.
Verify that the cabinet power is completely turned off and check that the target slot in the TDC 3000 card file is clean, dry, and free from debris.
Align the top and bottom guide tracks of the 51304718-200 card with the plastic tracks in the chassis slot.
Slide the module backward gently until the gold-plated edge connector meets the backplane bus. Apply even pressure on both top and bottom edges to seat the card securely.
Restore power and execute the system loop diagnostics sequence on your Honeywell engineering workstation to verify link establishment.
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Returns & Warranty

Processing analog instrumentation signals in heavy industrial process environments, the Honeywell 51304718-200 operates as a high-reliability High Level Analog Input (HLAI) and Smart Transmitter Interface (STI) module. Engineered for integration with the legacy TDC 3000 and Experion process control architectures, this input/output processor card interfaces field-mounted transmitters directly with the control network. It functions by digitizing standard 1-5 VDC or 4-20 mA process variable loops, supporting dual-channel communication options to ensure precise loop execution and high-fidelity signal acquisition without data degradation.
| Parameter | Specification |
|---|---|
| Manufacturer | Honeywell |
| Part Number / SKU | 51304718-200 |
| Module Type | HLAI / STI (High Level Analog Input / Smart Transmitter Interface) |
| System Platform Compatibility | TDC 3000 / TPS / Experion systems |
| Input Types | 1-5 VDC, 4-20 mA (via external shunt resistors) |
| Operating Temperature | 0 to 60 degC |
| Shipping Weight (Calculated) | 3.00 kg |
| Package Dimensions (Calculated) | 32.0 x 24.0 x 6.5 cm |
The 51304718-200 revision incorporates enhanced component layout and trace isolation over older -100 series assemblies. It maintains full backplane physical footprint compatibility but may require checking existing card file software revisions to ensure the correct microcode is loaded. It operates directly with the matching Field Termination Assembly (FTA) models dedicated to High Level Analog Input functions.
When utilizing this module in high-density process cabinets, thermal load tracking is essential. Ensure that surrounding card slots have adequate air circulation to prevent local cabinet hotspots from exceeding the 60 degC threshold. Additionally, keep passive and active loops isolated at the field termination barrier to prevent common-mode voltage offsets on the analog ground bus.
During commissioning, ensure that the shield drain wires are terminated strictly at one end (ideally at the FTA chassis ground point) to avoid creating ground loops. If field-side calibration drift is suspected, verify the integrity of the external shunt resistors on the terminal block before attempting to adjust the card software scaling values.
Disconnect all electrical power paths leading to the card file chassis before inserting or pulling the module. Hot-plugging a card into an unstable backplane or during active communication cycles can cause process disruptions, loop diagnostic faults, or component stress. Always ground yourself using an ESD wrist strap during handling.
Verify that the cabinet power is completely turned off and check that the target slot in the TDC 3000 card file is clean, dry, and free from debris.
Align the top and bottom guide tracks of the 51304718-200 card with the plastic tracks in the chassis slot.
Slide the module backward gently until the gold-plated edge connector meets the backplane bus. Apply even pressure on both top and bottom edges to seat the card securely.
Restore power and execute the system loop diagnostics sequence on your Honeywell engineering workstation to verify link establishment.
Global Express Shipping
Returns & Warranty
Orders are processed and delivered Monday-Friday (excluding public holidays).
For full eligibility, restocking fees, and international return details, please view our official Refund & Return Policy .
| Color pattern |
Greyish White
|
| Country of origin |
United States
|