ERI4374-0002 | BECKHOFF | Boîtier IO-Link

Description

Providing robust decentralized analog processing, the BECKHOFF ERI4374-0002 IO-Link box integrates versatile analog input and output capabilities directly into the field level. Designed to eliminate the need for protective control cabinets, this rugged combi module features two analog inputs and two analog outputs that can be parameterized independently for voltage (-10/0...+10 V) or current (0/4...20 mA) signals.

Operating via high-speed IO-Link communication under specification V1.1 (Class B) at data transfer rates up to 230.4 kbaud (COM3), this fieldbus module delivers precise 16-bit signal conversion. The heavy-duty zinc die-cast encapsulation ensures high resistance to mechanical stress, vibration, and environmental ingress, making it an ideal choice for challenging modern manufacturing environments.

Features

• Dual-Function Configuration: Combines 2 analog inputs and 2 analog outputs in a single IP67-rated housing.
• Flexible Signal Selection: Each channel can be individually configured for -10/0...+10 V or 0/4...20 mA signals.
• High-Performance Conversion: Rapid input conversion times of approximately 100 microseconds and output response times of roughly 40 microseconds.
• High-Resolution Signal Processing: 16-bit resolution (including sign) with an accuracy limit of less than 0.1% relative to the full scale value.
• Ruggedized Design: Die-cast zinc housing with IP65, IP66, and IP67 protection ratings, enabling direct on-machine mounting.
• Optimized Communication: Features an A-coded M12 connector supporting IO-Link V1.1 Class B communication at COM3 speeds.

Applications

• Decentralized process data acquisition in automotive and machine building plants.
• Direct control of proportional valves and hydraulic positioning systems.
• Distributed analog sensor integration in hazardous or high-moisture production zones.
• Testing rigs and assembly lines requiring compact, cabinet-free I/O layouts.

Technical Specifications

Connections and Interfaces

Installation Guidelines

• Mounting Location: The module can be installed in any physical orientation directly onto machine frames or structural profiles. Use the integrated mounting holes to secure the unit.
• Grounding and Shielding: Ensure the zinc die-cast housing has low-resistance contact to a grounded machine frame to maximize EMC protection. Use shielded cabling for all analog signals.
• Environmental Sealing: To achieve IP65/66/67 ingress protection, ensure all unused M12 connectors are sealed with appropriate protective caps, and all connected cables are tightened to the specified torque.
• Power Integrity: Verify that the IO-Link Class B port is connected to an approved master providing the correct auxiliary power (P24) and logic power (L+) levels.

Compliance and Certifications

• CE
• UL